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February 2004

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Subject:
EMBEDDED PASSIVE papers from Interpack Conference in 2003
From:
Dennis Fritz <[log in to unmask]>
Reply To:
D-37 Sub-Committee Forum <[log in to unmask]>, [log in to unmask]
Date:
Thu, 5 Feb 2004 10:35:14 -0600
Content-Type:
text/plain
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text/plain (91 lines) 
Here are four more published papers on embedded passives -
The conference was InterPack 2003. I believe the first person was from the
Jet Propulsion Labs-  John
        [log in to unmask]

----- Forwarded by Dennis Fritz/MacDermid/MACDERMID/US on 02/05/04 11:19
AM -----

   1. IPACK2003-35347 Development of Reliable Electronic Packaging
Solutions for Spacecraft Avionics Miniaturization Using Embedded Passive
Devices

Schatzel, D.
JOURNAL NAME- ADVANCES IN ELECTRONIC     PACKAGING
VOLUME TITLE- International electronic packaging technical conference and
exhibition; Rf microwave;  telecommunications; thermal management;
embedded passives; airborne; space and defense electronics systems
2003; VOL 2
PP. 797-800
ISBN- 0-79183-691-6
SPONSOR- American Society of Mechanical Engineers
PUBLISHER- ASME; 2003
CONFERENCE        DATE- 2003;  Jul
CONFERENCE LOCATION- Maui,       Hawaii
SHELFMARK- 0704.870000
MATERIAL TYPE- Papers
LANGUAGE- Eng
**********************************************
   2. IPACK2003-35230 New Substrates for Use as Embedded Capacitors

Yamamoto, T.;  Andresakis, J.

JOURNAL NAME- ADVANCES IN ELECTRONIC     PACKAGING
VOLUME TITLE- International electronic  packaging technical conference and
exhibition; Rf microwave; telecommunications; thermal management; embedded
passives; airborne; space and defense electronics systems
2003; VOL 2
PP. 741-746
ISBN- 0-79183-691-6
SPONSOR- American Society of Mechanical Engineers
PUBLISHER- ASME; 2003
CONFERENCE        DATE- 2003;  Jul
CONFERENCE LOCATION- Maui,       Hawaii
SHELFMARK- 0704.870000
MATERIAL TYPE- Papers
LANGUAGE- Eng
*******************************************
   3. IPACK2003-35149 Epoxy/BaTiO3 Composite  Embedded Capacitor Films
(ECFs) for Organic Substrates Applications

Cho, S.;  Hyun, J.-G.;  Paik, K.-W.

JOURNAL NAME- ADVANCES IN ELECTRONIC     PACKAGING
VOLUME TITLE- International electronic  packaging technical conference and
exhibition; Rf microwave; telecommunications; thermal management; embedded
passives; airborne; space  and defense electronics systems
2003; VOL 2
PP. 719-726
ISBN- 0-79183-691-6
SPONSOR- American Society of Mechanical Engineers
PUBLISHER- ASME; 2003
CONFERENCE        DATE- 2003;  Jul
CONFERENCE LOCATION- Maui,       Hawaii
SHELFMARK- 0704.870000
MATERIAL TYPE- Papers
LANGUAGE- Eng
*********************************************
   4. IPACK2003-35090 Ceramic  Resistors and Capacitors Embedded in
Organic Printed Wiring Boards


Borland, W.;  Felten, J. J.;  Dellis, L. E.;  Ferguson, S.;
Majumdar, D.;  Jones, A. B.;  Lux, M. S.;  Traylor, R. R.;  Doyle, M.

JOURNAL NAME- ADVANCES IN ELECTRONIC PACKAGING
VOLUME TITLE- International electronic packaging technical conference and
exhibition; Rf microwave; telecommunications; thermal management; embedded
passives; airborne; space and defense electronics systems
2003; VOL 2
PP. 713-718
ISBN- 0-79183-691-6
SPONSOR- American Society of Mechanical Engineers
PUBLISHER- ASME; 2003
CONFERENCE        DATE- 2003;  Jul
CONFERENCE LOCATION- Maui,       Hawaii
SHELFMARK- 0704.870000
MATERIAL TYPE- Papers
LANGUAGE- Eng

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