Reuven,
I have always wondered about that! Faster? And what about part reliability? In the cases where the elimination of water is not diffusion controlled, yes, it would be faster. However, if diffusion is the limiting step for the water coming to the surface of the component, then it does not make any difference how fast you draw it off the surface. In fact, I wonder if you could evaporate it fast enough (at lower temperatures and high vacuum) that you could freeze the water, thus making the water act as its own plug and limiting you to the sublimation of the surface ice? And what about dropping the external pressure and thus decreasing the boiling point of the water so it flash evaporates even easier? Couldn't this then cause popcorning at, say 60C? I don't know, I'm asking.
regards,
Bev Christian
Research in Motion
-----Original Message-----
From: Reuven ROKAH [mailto:[log in to unmask]]
Sent: February 17, 2004 9:42 AM
To: [log in to unmask]
Subject: Re: [TN] Baking IC's to J-STD-033 that are not in a suitable
packaging
I recommend to be more careful with BGAs components (drying before
production).
Vacuum oven is recommended for low temp. packages. (faster).
Best Regards
ROKAH Reuven
Kathy Kuhlow
<[log in to unmask] To: [log in to unmask]
OM> cc:
Sent by: TechNet Subject: Re: [TN] Baking IC's to J-STD-033 that are not in a suitable packaging
<[log in to unmask]
>
17/02/2004 16:24
Please respond
to "TechNet
E-Mail Forum.";
Please respond
to Kathy Kuhlow
We have a sealer, MBB bags, Labels, Desiccant, and indicator cards. When
we kit to a work order we open the package count out what is needed. Then
we repack both packages with the necessary items. The parts are put to the
kit and the inventory is returned. When any bag is cut open we look at the
indicator card and if the card is pink we bake them then. That way we
don't have production waits for the rebaking process. If production
returns moisture exposed parts we rebake prior to reinventory. Per 033 we
look at this as described under 8.2.
Kat
>>> [log in to unmask] 02/17/04 03:25AM >>>
Hi,
What is the general working practice when say a class-3 device comes
in vacuum shrinked wrapped with desicant and humidity indicator card
but is in tubes/sticks packaging or even sometimes in reels.
If the whole reel or pack of tubes are not all used up before the floor
life
expires and in theory the devices need to be re-processed @ 125 deg-C
for 24-hours??
I am wondering what most companies do regarding oven processing??
Any knowledge of this would be interesting.
Thanks,
> Douglas I McCall
> Printed Circuit Board Assembly Engineer,
>
> /// /// /// BOC EDWARDS
H BOC Edwards, 15 Marshall Road, Eastbourne, East Sussex, England, BN22
9BA
> * +44 (0)1323 501147
* +44(0)1323 509824
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>
>
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