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February 2004

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Subject:
From:
"Shangguan, Dongkai, Ph.D." <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Sun, 29 Feb 2004 19:32:18 -0800
Content-Type:
text/plain
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text/plain (63 lines)
For Sn/3.5Ag, please refer to the following paper:
 "J.R. Lloyd, C. Zhang, H.L. Tan, D. Shangguan, and A. Achari, Measurement
of Thermal Conductivity and Specific Heat of Lead Free Solder.  Proceedings
of the 1995 IEEE/CPMT International Electronics Manufacturing Technology
Symposium, October 1995, Austin, TX, pp. 252-262."


Regards,
Dongkai Shangguan, Ph.D.
Director - Advanced Process Technology
FLEXTRONICS
2090 Fortune Drive, San Jose, CA 95131
Phone: (408) 428 1336     Fax: (408) 576 7988
[log in to unmask]



-----Original Message-----
From: Brian Chong [mailto:[log in to unmask]]
Sent: Sunday, February 29, 2004 5:27 PM
To: [log in to unmask]
Subject: [LF] Thermal Conductivity Data - Leadfree Solder Question


Hello Everybody,
  Does anyone know the value for thermal conductivity (W/mK) for
  the following solder alloy ?
  Alloy
  42Sn/58Bi
  42Sn/57Bi/1Ag
  63Sn/37Pb
  96.5Sn/3Ag/0.5Cu
  95.5Sn/4Ag/0.5Cu
  96.5Sn/3.5Ag

  Pls reply directly to email.Thanks

  Best regards
  Brian Chong
  Asahi Chemical Research Lab


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