LEADFREE Archives

February 2004

Leadfree@IPC.ORG
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Subject:
Re: Question on lead-free wave solder processes
From:
MA/NY DDave <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Sun, 22 Feb 2004 23:24:57 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (16 lines) 
Hi Ken, and IPC LF Listservers,

With the increased contact time with the wave how do you manage the droop
of the PCB. Do you use fixtures or rails to support it? Do you notice any
more interlaminate fractures post wave solder.

YiEngr, MA/NY DDave

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