For the Sn-Cu-Ni alloy that is being quite widely used in Asia the
recommended range has been 250-260C depending on how heavy the board is with the lower
end of the range being for light single sided.    For some of the heavier
telecom boards encountered in the US market the range has been extended to 265C to
get topside fillet on through holes on heavy components like connectors.

Of course an adjusting factor is preheat and the recommended range is
100-130C topside (with due allowance for the difficulty of deciding where to measure
topside preheat).     Contact times are a little longer also, around 3 seconds
typically.

I think that the SAC alloys with a MP of 217C vs 227C for the Sn-Cu-Ni can be
a little lower in solder temperature, perhaps 5C less.

Keith Sweatman
Nihon Superior Co., Ltd

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