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February 2004

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Subject:
From:
MA/NY DDave <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 4 Feb 2004 22:06:43 -0600
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text/plain
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text/plain (33 lines)
Hi Scott, etc, and IPC LF Listservers,

I see at least three new notes in Feb on this subject.

The version of the The Tyco report from Tyco Belgium that I have is pretty
nice and shows that all the finishes can be used with different
precautions, insertion and retention forces, and concerns. This would be
pretty much consistent with what we or at least I should expect.

Ofer in Jan noted a long term reliability concern which I don't know about
and can't find, yet would expect to exist and should be variable per board
manufacturer, pin manufacturer, pin inserter, etc etc, including the
engineers and the top powers of any company.

I don't see any high temp, thermal cycling, accelerated thermal cycling,
environmental and other types of tests that would make me choose one finish
with it's precautions over another.

Ofer or Hilty or others, please correct me.

Again the Tyco report is done well.


YiEngr, MA/NY DDave

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