Dewey
I reproduce what the 2002 edition of Oxford says:
[quote]
solder, noun & verb.
Also sodder. ME.
A. noun.
1. A fusible metallic alloy used for uniting less fusible metal
surfaces or parts. ME.
hard solder: fusible at a relatively high temperature and typically
containing brass and silver. silver solder: see SILVER noun & adjective.
soft solder (a) solder fusible at a relatively low temperature,
typically containing lead and tin; (b) fig. (arch.) flattery (cf. SAWDER
noun). spelter solder: see SPELTER 2.
2. fig. Something which unites things; esp. a unifying quality or
principle. L16.
B. verb.
I. verb trans.
1. Unite, fasten, or repair by means of metallic solder. Foll. by to,
on, together, etc. LME.
2. Medicine. Cause (a wound) to close up and become whole; reunite
(tissues or bones). L15L18.
3. transf. & fig. Unite firmly or closely, join, cause to adhere.
Also, restore to a sound condition, patch up again. M16.
II. verb intrans.
4. Adhere, unite, grow together. Chiefly fig. L15.
soldera"bility noun the property of being solderable M20.
solderable adjective able to be joined by means of solder M20.
solderer noun a person who works with solder M16.
soldering noun (a) the action of the verb; (
soldering iron, a tool for applying molten solder); (b) solder: LME.
solderless adjective made without solder; not requiring solder: E20.
[/quote]
Note that the verb I.3 definition offers 'join', and nowhere 'connect'.
I therefore surmise that 'joint' is correct if 'solder' is used
attributatively. If the 2002 edition of the Oxford English Dictionary
says so, then this is darn hootin' good enough for me!!! :-) Sorry,
Jack! And what if a solder joint is used to fix something mechanically
to a printed circuit, without an electrical function, how can anyone
consider this a connection (or even an unused connector pin)?
:-D
Brian
Whittaker, Dewey (AZ75) wrote:
> Dave,
> I agree with you except for one thing.You used the term joint and after
> being severely chastised in a public forum by Jack Crawford at how backward
> and antiquated my terminology was,I believe I would use the term connection
> in refering to solder and joint as a place to listen to Bob Seger.I have
> updated all my specifications to replace the term joint with
> connection.Public embarrassment is a powerful tool.
> Dewey
>
>
>>-----Original Message-----
>>From: Dave Hillman [SMTP:[log in to unmask]]
>>Sent: Thursday, February 12, 2004 6:50 AM
>>To: [log in to unmask]
>>Subject: Re: [LF] : technical question: annealing time and
>>temperature
>>
>>Hi Keith! Absolutely - as a materials engineer I find the new
>>intermetallics and their potential impact on solder joint reliability a
>>very cool topic but that same enthusiasm is not shared by our process
>>IE's!
>>I like the idea of using element additions to create/control the solder
>>joint microstructure instead locking in on a controlled cooling rate
>>methodology - it would possibly allow me to have a much more robust
>>process window and be less sensitive to process variation. Hopefully such
>>a
>>solution will be characterized, demonstrated, and made available for
>>future
>>industry use.
>>
>>Dave
>>
>>
>>
>> [log in to unmask]
>> Sent by: Leadfree To: [log in to unmask]
>> <[log in to unmask] cc:
>> > Subject: Re: [LF] :
>>technical question: annealing time and temperature
>>
>>
>> 02/12/2004 04:27
>> AM
>> Please respond to
>> "(Leadfree
>> Electronics
>> Assembly Forum)";
>> Please respond to
>> KSweatman
>>
>>
>>
>>
>>
>>
>>Dave,
>>
>>To take up one point in your very interesting and useful contribution- the
>>possible benefits of controlling the morphology of the intermetallics that
>>are
>>one of the features that distinguish the lead-free solders from tin-lead
>>solder, cooling rate may be one option but that is difficult to control in
>>real
>>soldered joints in complex assemblies.
>>
>>However, the Ames laboratory and others have found some interesting
>>effects
>>of ternary or quaternary additions of elements that incorporate
>>preferentially
>>in the intermetallic crystal structure and modify its nucleation and
>>growth
>>behaviour. That is possibly are more effective and reliable way of
>>managing
>>the intermetallic morphology than trying to control cooling rates.
>>
>>Keith Sweatman
>>Nihon Superior Co., Ltd
>>
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