But how much are you or your company prepared to pay?
Regards
Mike
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Dave Hillman
Sent: Thursday, February 12, 2004 1:50 PM
To: [log in to unmask]
Subject: Re: [LF] : technical question: annealing time and temperature
Hi Keith! Absolutely - as a materials engineer I find the new
intermetallics and their potential impact on solder joint reliability a
very cool topic but that same enthusiasm is not shared by our process
IE's! I like the idea of using element additions to create/control the
solder joint microstructure instead locking in on a controlled cooling
rate methodology - it would possibly allow me to have a much more
robust process window and be less sensitive to process variation.
Hopefully such a solution will be characterized, demonstrated, and made
available for future industry use.
Dave
[log in to unmask]
Sent by: Leadfree To:
[log in to unmask]
<[log in to unmask] cc:
> Subject: Re: [LF] :
technical question: annealing time and temperature
02/12/2004 04:27
AM
Please respond to
"(Leadfree
Electronics
Assembly Forum)";
Please respond to
KSweatman
Dave,
To take up one point in your very interesting and useful contribution-
the possible benefits of controlling the morphology of the
intermetallics that are one of the features that distinguish the
lead-free solders from tin-lead solder, cooling rate may be one option
but that is difficult to control in real soldered joints in complex
assemblies.
However, the Ames laboratory and others have found some interesting
effects of ternary or quaternary additions of elements that incorporate
preferentially in the intermetallic crystal structure and modify its
nucleation and growth
behaviour. That is possibly are more effective and reliable way of
managing
the intermetallic morphology than trying to control cooling rates.
Keith Sweatman
Nihon Superior Co., Ltd
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