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February 2004

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Subject:
From:
MA/NY DDave <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 9 Feb 2004 22:26:30 -0600
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Hi Tyco-BHilty, & IPC LF Listservers,

One disagreement with a portion of Bob's note


>I think the trend is to go to Cu-OSP for the board finish.
>
>Cheers,
>
>Bob


Bob, I actually have heard more presenters come against OSP than for it. I
am not sure of their reasons or rationale, yet it seems like common
knowledge that somehow I am supposed to know.


YiEngr, MA/NY DDave

P.S. Long ago I was an engineer qualifying one of the first major volume
applications of Entek's Cu56 OSP.  I didn't like it and it was difficult to
control the process output. Hey just an aside.

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