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From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Mon, 9 Feb 2004 22:26:30 -0600 |
Content-Type: | text/plain |
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Hi Tyco-BHilty, & IPC LF Listservers,
One disagreement with a portion of Bob's note
>I think the trend is to go to Cu-OSP for the board finish.
>
>Cheers,
>
>Bob
Bob, I actually have heard more presenters come against OSP than for it. I
am not sure of their reasons or rationale, yet it seems like common
knowledge that somehow I am supposed to know.
YiEngr, MA/NY DDave
P.S. Long ago I was an engineer qualifying one of the first major volume
applications of Entek's Cu56 OSP. I didn't like it and it was difficult to
control the process output. Hey just an aside.
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