Hello all,
Technical question: are there established quantitative guidelines for
annealing / ageing time and temperature for solder testing specimens? (as in shear /
tensile, creep testing etc...)

I see numbers that are all over the place: from 1 to 100 hours at
temperatures from room temperature to 60C, 100C, 160C...(those are numbers I ran into for
lead-free alloys like SAC), so I am trying to understand where the numbers
come from.
Many publications state that their specific conditions provide for a
micro-structure similar to that of common solder joints.  Others also state that this
provides for the necessary stress relief.  Apparently, different labs have
very different approaches to achieve similar goals.  However, most of these
conditions alter the initial microstructure, and thus the mechanical properties, in
many different ways.

Thanks for your help,
Jean-Paul
_____________________________________
Jean-Paul Clech
EPSI Inc.
Home page URL: http://jpclech.com
P.O. Box 1522
Montclair, NJ 07042
USA
tel: 973-746-3796
fax: 973-655-0815

-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-------------------------------------------------------------------------------