Here is the link to the technical sessions at IPC Expo on February 26:

http://www.ipcprintedcircuitexpo.org/expoconf.asp

That also is linked to registration and other events in two weeks. 

The paper titles and times are as follows"
 Embedded Passives-Design 
   2/26/2004   9:30 AM - 11:30 AM  
  David McGregor, DuPont Company, Chairman

  Embedded passives offer the designer and board manufacturer a host of new 
concerns and challenges in today’s market. This is the first of two sessions 
showcasing this new and rapidly growing technology.


Designing Embedded Resistors and Capacitors
Richard Snogren, Coretec Inc. 

Design Considerations for Thin Film Embedded Resistor and Capacitor 
Technologies
Percy Chinoy, Ph.D., Rohm and Haas Electric Materials 

Embedded Passives in High Layer Count High Reliability Printed Wiring Boards
Michael Luke, Raytheon Co.

"Built-In-Trace" Resistors
Daniel Brandler, Ohmega Technologies 

 
   Embedded Passives- Materials and Processes 
   2/26/2004   1:00 PM - 2:30 PM  
  David McGregor, DuPont Company, Chairman

 
  This second embedded passives session focuses on what's new in materials 
for this growing technology. Join us to hear about the new materials and related 
processing techniques that may likely be in your future.


Performance of Polymeric Ultra-thin Substrates for use as Embedded 
Capacitors: Comparison of Unfilled and Filled Systems with Ferroelectric Particles
John Andresakis, Oak-Mitsui 

Decoupling with Anodized Ta
Richard Ulrich, Ph.D., University of Arkansas 

New Developments in Polymer Thick Film Resistor Technology
Gregory Dunn, Motorola