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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 18 Feb 2004 12:10:14 -0500 |
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Vladimir,
Since no real "plating person" has yet replied, I will toss out what meager info I have.
My notes were that <1% B yielded readily solderable and wedge bondable surfaces where as baths of 2-3% B were noticeably hard (but no notation on wirebondability or solderability). Some baths can be 5-6% B, but have no specific comments of them either.
Should you get any further comments, I am very interested in them as well.
Sorry, but I can not define what 'normal' is. Presume it is specific to the plating house and what they are currently running.
Steven Creswick - Gentex Corporation
-----Original Message-----
From: Vladimir Igoshev [mailto:[log in to unmask]]
Sent: Tuesday, February 17, 2004 1:32 PM
To: [log in to unmask]
Subject: [TN] Electroless Ni-B
Techneters,
Does anybody know what a "normal" content of boron should be in an electroless Ni-B plating?
Thanks a lot in advance.
Vladimir Igoshev,
Research in Motion
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