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Fri, 20 Feb 2004 08:57:56 -0700 |
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See attached PDF file. If you can't see it email me and I will send it to you.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Karnwal, Pankaj
Sent: Thursday, February 19, 2004 9:04 PM
To: [log in to unmask]
Subject: [TN] BGA re balling process
Dear all
What is the BGA re-balling process; what is the reliability rating ;anybody
doing , can give me the details of the process. Reflow temp., backing of the
BGA ,ect.
Thanx
BR
Pankaj Karnwal
Jr. Engineer QA
Barco Electronics System (P) Ltd.
WWW.barco.com
mailto:[log in to unmask]
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Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
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