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February 2004

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Wed, 18 Feb 2004 12:00:37 -0600
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"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
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Dave Hillman <[log in to unmask]>
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Hi guys! Well, here is more information to add to the confusion; The Metal
Finish Suppliers Association Electroless Nickel Plating Guide (volume 1,
no. 5) lists specifically a boron range of 0.1%-0.3% for soldering
applications and describes in general of keeping the boron less than 1% for
solderability.

Dave Hillman
Rockwell Collins
[log in to unmask]



                      Vladimir Igoshev
                      <[log in to unmask]        To:       [log in to unmask]
                      >                        cc:
                      Sent by: TechNet         Subject:  Re: [TN] Electroless Ni-B
                      <[log in to unmask]>


                      02/18/2004 11:29
                      AM
                      Please respond to
                      "TechNet E-Mail
                      Forum."; Please
                      respond to
                      Vladimir Igoshev






Steven,

Thanks a lot. I haven't been very successful in my search. So far I found
very contradictory data, saying that for a solderable surface it should be
between 0.1% and 10% of B, or up to 3-5% (from another source). I've also
posted the question on the www.finishing.com website and hope it'll help.
You can keep an eye on it from here.
http://www.finishing.com/274/65.html
I want to know what the difference is at the solder/plating interface
between two types of EN. May I ask what is your concern?


Regards,

Vladimir

Vladimir Igoshev,
Research in Motion

Voice: (+1) 519-888-7465, ext. 5283
Fax: (+1) 519-886-0863
E-mail: [log in to unmask] <mailto:[log in to unmask]>


-----Original Message-----
From: Creswick, Steven [mailto:[log in to unmask]]
Sent: Wednesday, February 18, 2004 12:10 PM
To: TechNet E-Mail Forum.; Vladimir Igoshev
Subject: RE: [TN] Electroless Ni-B


Vladimir,

Since no real "plating person" has yet replied, I will toss out what meager
info I have.

My notes were that <1% B yielded readily solderable and wedge bondable
surfaces where as baths of 2-3% B were noticeably hard (but no notation on
wirebondability or solderability).  Some baths can be 5-6% B, but have no
specific comments of them either.

Should you get any further comments, I am very interested in them as well.

Sorry, but I can not define what 'normal' is.  Presume it is specific to
the plating house and what they are currently running.

Steven Creswick - Gentex Corporation



-----Original Message-----
From: Vladimir Igoshev [mailto:[log in to unmask]]
Sent: Tuesday, February 17, 2004 1:32 PM
To: [log in to unmask]
Subject: [TN] Electroless Ni-B


Techneters,

Does anybody know what a "normal" content of boron should be in an
electroless Ni-B plating?

Thanks a lot in advance.

Vladimir Igoshev,
Research in Motion

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