TECHNET Archives

January 2004

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Robert Frank <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 14 Jan 2004 07:57:54 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines)
Is it acceptable to use the same soldering iron/tip and sponge for both water-soluble flux/solder and  no-clean?  This seems to be a common practice, but is there problem with cross-contamination or is it not worth worrying about?
 
If not an issue with water-soluble and no-clean, will it be with no-lead solders?
 

Robert Frank 
QA Manager 
Custom Products Division 
diversified systems, inc. 
Tel:  317-299-9547 x297 

 

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2