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January 2004

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Subject:
From:
Eric Laroche <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 12 Jan 2004 08:44:40 -0500
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Good morning Guy,

Would you mind sharing some specifications regarding this "gadget".  I
have looked into a "Mole" wave profiler but I find it very expensive.

Thanks,

Eric

-----Message d'origine-----
De : TechNet [mailto:[log in to unmask]] De la part de Guy Ramsey
Envoyé : 12 janvier, 2004 08:33
À : [log in to unmask]
Objet : Re: [TN] Comment on Wave Solder Profile Method

Assembly Profile development: The method is sloppy but probably works
okay most of the time. What do they do when the results are bad?
Machine maintenance: Once a good profile has been established the task
becomes verification of process stability. Machine controls do drift
over time. Manufacturers of wave solder equipment usually recommend a
schedule for verification of preheat, conveyor, solder pot, flux density
and other controls.
I used a gadget to check preheat temperature, conveyor speed, solder pot
temperature, and wave dynamics every morning.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Bogert
> Sent: Saturday, January 10, 2004 9:10 AM
> To: [log in to unmask]
> Subject: [TN] Comment on Wave Solder Profile Method
>
>
> January 10, 2004
>
> Folks, I am aware of an OEM who establishes his wave solder
> profiles by using an unpopulated printed wiring board, which
> has thermocouples attached on the solder destination side.
> After the profile is completed, a first piece assembly is 100
> percent visually inspected, and if the results are OK, the
> prifile is saved and logged in document control, and unless
> there are solder problems on subsequent production units,
> that specific assembly part number is normally never solder
> profiled again.  The machine setup (e.g. speed, temperature
> sensors, etc are in the periodic calibration program).  For
> reflow profiling, the OEM uses an actual printed wiring
> assembly with thermocouples attached.
>
> I have several questions on solder profiling, as follows:
>
> 1.    I am not aware of any IPC or military  specification
> requirement that mandates any specific method for solder
> profiling, or for how often (if ever) a profile needs to be
> repeated once it has bewen established for a given part
> number assembly.
>
> 2.    I am aware of all flavors of solder profiling (e.g.,
> machine profile just using the built in solder machine
> sensors; machine profile using just temperature dots on the
> top side of the printed wiring assembly; machine profile
> using a mole or other type of instrumented device; and
> thermocouples on an actual printed wiring assembly).  It
> appears that as long as one gets an acceptable solder joint,
> any of these methods are acceptable for profiling wave solder.
>
> What method do you folks use for profiling for reflow and
> wave solder?  Is wave solder profile using the unpopulated
> printed wiring board an acceptable method?  If one continues
> to get acceptable solder joints, how often (if ever) do folks
> repeat a solder profile on a given part

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