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January 2004

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Subject:
From:
Ernie Fung <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 12 Jan 2004 01:23:42 -0600
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Hi
I am now working on the MLCC clearance near the PCB edge for depaneling. Is
there any simular test that has been done before?
Moreover, I would like to observe internal crack in MLCC. X ray and
ultrasonic may not measure the "hair" crack due to the low resolution, but
is it possible for using eddy current for the measurement?

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