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January 2004

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Subject:
From:
Steve Kelly <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 9 Jan 2004 14:00:02 -0500
Content-Type:
text/plain
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text/plain (82 lines)
Hi Doug,

Before Xmas I had asked a question on the Technet about cleaning of wire
bondable gold pads. One of the answers I received was to do plasma and after
doing some further research I actually found some articles also recommending
this process.
Regards Steve Kelly



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Dehoyos, Ramon
Sent: Friday, January 09, 2004 1:47 PM
To: [log in to unmask]
Subject: Re: [TN] plasma

        Doug:
        Check for leakage. Do a leak check on the chamber. It may have too
much air going in through a seal. .
        Regards,
        Ramon

> -----Original Message-----
> From: Doug Pauls [SMTP:[log in to unmask]]
> Sent: Friday, January 09, 2004 10:35 AM
> To:   [log in to unmask]
> Subject:      [TN] plasma
>
> Good morning all,
>
> I have a question related to plasma cleaning.  We have two plasma
cleaners,
> same model, using Argon-Hydrogen in both, same mixture, same power level,
> but the plasma in one appears more purple than the plasm in the second
> cleaner.  Any ideas as to why?
>
> Secondly, does anyone know if repeated exposure to plasma cleaning will
> degrade the surface of a gold pad and thus reduce bond wire strength?
>
> Thanks.
>
> Doug Pauls
> Rockwell Collins
>
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