With the UP2000 we measure for presence based on how the pad is programmed.
We have some products that we inspect not only fine pitch but go to great
lengths to even inspect resistor pacs and SOICs. When we do a run we inspect
100% of the boards that go into our placement machines.

In-line systems help reduce handling and help machine uptime. Just my .02.

Dan Dodson

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Blair K. Hogg
Sent: Friday, January 09, 2004 8:58 AM
To: [log in to unmask]
Subject: Re: [TN] Paste inspection on the stencilprinter


Technetters,

I've been following this thread with interest as I feel that this is an
area for opportunity for improvement in our process. We currently do not
use any machine inspection for paste and rely on the operator to perform
a visual inspection prior to pick and place.

For those of you that use machine inspection, do you measure for height
or just presence? Is it generally performed only in critical areas such
as fine pitch and in the corners/edges of the board, as Dan Dodson does,
or on a larger sample? Does anyone 100% every pad? Do you check every
board, or just a sample? What is more common, off-line systems or
in-line systems?

Thanks,

Blair Hogg
QA Manager
GAI-Tronics Corporation


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