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January 2004

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 9 Jan 2004 09:45:41 -0500
Content-Type:
text/plain
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text/plain (39 lines)
It really depends on the risk. Low volume, low value, no unusual rework
issues is one thing.
High value, difficult rework, high likelihood of scrap, is another. The
high value, high density, difficult and risky rework stuff is represents
a larger percentage of the work we see in the USA. The other stuff seems
to be moving off shore like migrating birds.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of d. terstegge
> Sent: Friday, January 09, 2004 8:49 AM
> To: [log in to unmask]
> Subject: [TN] Paste inspection on the stencilprinter
>
>
> Hi Technet,
>
> We've recently seen some threads on this forum about
> inspection-machines for solder paste. I am just curious to
> know how many of you are using inspection capabilities that
> are available in most stencilprinters. The lack of postings
> about this subject makes me think that I'm probably not the
> only one who decided that for low volumes the advantages are
> not worth the programming-efforts. Any comments ?
>
> Daan Terstegge
> Thales Communications
> Unclassified mail
> Personal Website: http://www.smtinfo.net

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