Daan,

I do the programming for our UP2000 printer. I know when I do the
programming for low and high volume the extra 5 - 10 min of programming at
least 3 locations are worth it. We can control the quality of product going
into our placement machines. On high volume products I usually program at
least 5 locations. The locations are usually fine-pitched parts and at least
one component on each edge to ensure that paste coverage is consistent
across the board. I figure the more we can inspect the less we will have to
worry about when the product comes out the oven. Hope this helps.

Dan Dodson
Tri-onics Inc.
E-Mail: [log in to unmask]


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of d. terstegge
Sent: Friday, January 09, 2004 7:53 AM
To: [log in to unmask]
Subject: [TN] Paste inspection on the stencilprinter


Hi Technet,

We've recently seen some threads on this forum about
inspection-machines for solder paste. I am just curious to know how many
of you are using inspection capabilities that are available in most
stencilprinters. The lack of postings about this subject makes me think
that I'm probably not the only one who decided that for low volumes the
advantages are not worth the programming-efforts.
Any comments ?

Daan Terstegge
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net

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