TECHNET Archives

January 2004

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Dave Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 30 Jan 2004 11:55:28 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (72 lines)
Hi Vladimir! I recommend you look over the Journal of Electronic Materials
article abstracts - lots of good data with some fracture toughness studies
(especially during the 2001-2004 period). Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]



                      Vladimir Igoshev
                      <[log in to unmask]        To:       [log in to unmask]
                      >                        cc:
                      Sent by: TechNet         Subject:  [TN] Fracture toughness of ENIG interface
                      <[log in to unmask]>


                      01/30/2004 10:15
                      AM
                      Please respond to
                      "TechNet E-Mail
                      Forum."; Please
                      respond to
                      Vladimir Igoshev






Hi everybody,

I'm looking for information on the fracture toughness of the solder/solder
pad interface after soldering to EHIG finished pads. So far I have found
just one or two relevant references and would appreciate any additional
information.

Thanks a lot in advance.

Regards,


Vladimir Igoshev
Research in Motion
Voice: (+1) 519-888-7465, ext. 5283
Fax: (+1) 519-886-0863
E-mail: [log in to unmask] <mailto:[log in to unmask]>

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
-----------------------------------------------------

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2