Hi everybody,

I'm looking for information on the fracture toughness of the solder/solder pad interface after soldering to EHIG finished pads. So far I have found just one or two relevant references and would appreciate any additional information. 

Thanks a lot in advance.

Regards,


Vladimir Igoshev
Research in Motion
Voice: (+1) 519-888-7465, ext. 5283
Fax: (+1) 519-886-0863
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