'Morning Fellow Techies,
 
Does anyone have any experiences with the process of underfill to help protect solder 
interconnects from the effects of thermal expansion mis-match between a ceramic
substrate and the FR4 board? If so, what are some of the considerations to think about?  
 
Thanks if Advance,
 
Michael Laroe
Mfg. Engineer
MSL-Lowell
(978)677-2977 (v)
(978)454-9200 (f)
[log in to unmask]

 


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