Steve,
You are not being paranoid. I will say the same thing.
We just cannot leave it to chance that whatever impurity that is left
behind will stay begnin and inactive throughout the product life cycle.
Jsut my 0.1cent contribution.
Regards,
Wee Mei
Steve Gregory wrote:
>Hi Joe!
>
>This topic has come up before, and there has been inputs from Brian Ellis,
>and Doug Pauls on this issue...if I remember correctly, it's not a good idea. If
>I'm wrong, please correct me.
>
>Thinking about the big picture, I have my own thoughts. Once an assembly is
>coated, you have effectively sealed everything that's on the board in beneath
>the coating.
>
>If the bare board came in absolutely clean, and everybody wore gloves when
>handling the fabs so as to not contaminate the board with skin salts, all the
>flux was activated from reflow or wave, and no touch-up was done on the
>assembly...then maybe, just maybe, I might say it's okay.
>
>If an assembly needs coating because of the environment it will be in, I just
>think it's best to clean it as well as possible to remove everything and then
>coat it. I may be paranoid, but that's just me...
>
>-Steve Gregory-
>
>
>Fellow Techeads,
>
>It has been suggested by one of our CMs that it is acceptable to conformal
>coat (type AR) over no clean flux residue. Would anyone like to share their
>opinions or experience on this subject. Conformal coating over residue does
>not sound like the correct thing to do. thanks
>
>joe
>
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