IPC/JEDEC 2004 International Conferences on Lead-Free Electronic
Assemblies and Components
5th International Conference March 17-19, 2004 * San Jose Marriott * San Jose, CA
6th International Conference August 2004 *Singapore
7th International Conference October 20-22, 2004 * Intercontinental * Frankfurt, Germany
IPC - Association Connecting Electronics Industries and JEDEC - the Solid State Technology Association are announcing three International Lead Free conferences in the U.S., Europe and Asia. Firm dates are established for the U.S. Specific dates and venues for Singapore and Frankfurt will be confirmed soon. David Bergman/Jean Hebeisen, IPC and John Kelly/Donna McEntire, JEDEC, are the Conference Chairs.
July 1, 2006 is the target date that the Directive on the Restriction of Hazardous Substances in Electrical and Electronic Equipment will require the majority if electronic products sold in Europe be lead-free. The European Union continues the march forward towards lead elimination in most electronics. Public and political pressure against lead continues to grow. International OEMs are becoming more sensitive to the issue and continue to press their suppliers to develop plans. Resistance to change is all but a memory now as companies consider the practical aspects they must consider making the change to lead-free.
Data keeps coming in from individual companies' and consortia efforts. Many challenges still exist and the path forward to success is not one of consensus. Companies need to stay aware of the hot issues remaining in order to focus efforts that will allow success to be achieved by 2006.
Papers are sought in all areas, including:
* Policy - European Lead Ban status
* EMS Industry - on the front line of the change.
* Component issues (Passives and Actives)
* Design issues
* Environmental health and safety effects (on the alternatives too!)
* PCB issues
* OEM/Consumer demands/voluntary elimination dates
* Recycling options
* Substitution - New commercially available alloys/conductive adhesives/ease of replacement
* Cost issues
* Reliability evaluations, e.g., temperature cycling data, tin whiskers evaluation
* Roadblocks to implementation
* Finishes issues - Organic solder protectants, immersion tin, silver, electroless nickel, palladium, etc.
* Lead-free and other product sectors (automotive, aerospace, etc.)
The International Lead-Free Conference offers time slots between 30-45 minutes long. Some papers may be grouped together in a forum or panel discussion. To submit an abstract, please complete the second page of this form and include an abstract of 200-300 words along with a brief biography (or you may provide the same information via e-mail to [log in to unmask]) in accordance with the deadline shown below.
Presentation materials and papers must be non-commercial in nature, focusing on technology rather than a company's product. It is mandatory to provide a print-quality paper or hard copies of visuals for the conference proceedings in order to deliver an oral presentation
Abstract Submission Paper deadline for Accepted Abstracts
San Jose January 23, 2004 February 27, 2004
Singapore May 28, 2004 July 23, 2004
Frankfurt July 30, 2004 September 24, 2004
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