Hi,

What is the latest on the timeline for lead free switch over?  Is it 2006
for European countries?, What about the US?  Any chance for delays, or is
this really going to happen?

Regarding equipment, particularly smaller (table top) style re-flow
ovens......With the requirement of additional heat to reflow lead free
solder, are the existing smaller ovens on the market capable of handling the
newer profiles?  Has anyone tried using smaller ovens to reflow lead free
solder?  Any recommendations on the minimum "zones" needed to reflow lead
free?

Thanks in advance for your help!

Jim

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