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January 2004

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Subject:
From:
"Dehoyos, Ramon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 28 Jan 2004 06:06:37 -0800
Content-Type:
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        Guenter:
        I really appreciate your info. We are looking forward to use this
technology, and we would like to be as informed as possible and do plenty of
experiments before we start building production. So far the inputs have been
mostly positive.
        Thanks,
        Ramon

> -----Original Message-----
> From: Guenter Grossmann [SMTP:[log in to unmask]]
> Sent: Wednesday, January 28, 2004 8:10 AM
> To:   [log in to unmask]
> Subject:      [TN] Antw: [TN] SiPad
>
> Ramon
>
> We looked at SIPAD in a former project with great success. No failures
> due to paste printing, easy placement of components, we could even place
> QFP 0.3 by hand.
> There is one problem though (as always): The sticky flux on the surface
> gets liquid when hot which means that the bare boards must stay cool.
> There once one a case where the truck delivering the boards stood in the
> sun over the weekend and the boards where a sticky mess.
>
> Best regards
>
> Guenter
>
>
>
> EMPA
> Swiss Federal Laboratories  for Materials Testing and Research
> Centre for Reliability
> Guenter Grossmann,  Senior Engineer
>
> 8600 Duebendorf
> Switzerland
>
> Phone: xx41 1 823 4279
> Fax :     xx41 1 823 4054
> mail:     [log in to unmask]
>
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