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January 2004

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Subject:
From:
Richard Kraszewski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 27 Jan 2004 20:59:25 -0500
Content-Type:
text/plain
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text/plain (72 lines)
I understand that Infineon has adopted this Ni underplating strategy
extensively for their Pb-Free line.

Rich Kraszewski 
Advanced Manufacturing Engineer - KEDS
Phone:  260.925.8919
Pager:  812.481.3492
 
 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Guenter Grossmann
Sent: Monday, January 26, 2004 11:39 AM
To: [log in to unmask]
Subject: Re: [TN] Antw: [TN] Lead-free Component Finishes


Jim

I was talking last week with a person from Motorola Germany and a
someone from Collini. In the discussion both told me that by using a Ni-
underplate and with the appropriate plating chemistry they don't' see
problems with whiskers anymore. Earlier, in a conference from
Electrosuisse, I had a discussion with a speaker talking about whisker
growth as a function of grain size of the Sn plating which can be
controlled with the appropriate chemistry and process parameters. What I
learned in these discussion was that whiskers are a problem that can be
controlled. In the worst case, in my understanding, it's a question of
money. Annealing the plating can reduce the internal stress in the
plating and diminish whisker growth. Wrong?

Best regards

Guenter



EMPA
Swiss Federal Laboratories  for Materials Testing and Research Centre
for Reliability Guenter Grossmann,  Senior Engineer

8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :     xx41 1 823 4054
mail:     [log in to unmask]

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