Werner,
I agree. I forgot to mention the solder fillet reduction. I also forgot to indicate that our other internal requirment is to mount ceramic chip capacitors with their long axis parallel rather than perpendicular to the nearest edge.
Regards,
George
George M. Wenger (908)-546-4531
Reliability Engineer
RF Power Amplifier Group
Andrew Corporation, 40 Technology Drive, Warren, NJ 07059
[log in to unmask]
-----Original Message-----
From: Werner Engelmaier [mailto:[log in to unmask]]
Sent: Tuesday, January 06, 2004 11:38 AM
To: [log in to unmask]
Subject: Re: [TN] CC Mechanical stress
Hi,
George gave good advice. A further measure is to REDUCE the size of the
solder fillets--large solder fillets act like vise-grips during high-strain-rate
loading such as riveting and depanelizing. Large solder fillets serve no real
purpose for samall CC's.
Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com
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