Lee,
Did any of your tests included lead free BGA/CGA's combined with SnPb
solder paste?
If so what were the results.
David A. Douthit
Manager
LoCan LLC
Lee Whiteman wrote:
>Jim,
>
>1. ACI built hardware with SnPb solders, using components finished with
>Lead Free finishes (Sn, Pd, NiPd, etc.) for the Lead Free Components
>Focus Group and our own internal Lead Free Projects, and found no
>incompatibilities. Of course, the metallurgy of the solder joint was
>different than what you would expect with SnPb finishes.
>
>2. My gut tells me that sooner or later (~ 2006 timeframe), SnPb
>finishes will no longer be available in the long term. As the conversion
>from SnPb to Lead Free continues, the availability of components
>finished with SnPb will decrease. IMHO, the component market requirement
>for SnPb finished components will not be sufficiently large enough to
>have component manufacturers support both a SnPb and Lead Free
>production line for the same electronic package. Of course this also
>depends on the type of packages (chip components vs. leaded SMT devices
>vs. etc.).
>
>Hope this helps.
>
>Good Luck.
>
>Lee Whiteman
>Senior Manufacturing Engineer
>American Competitiveness Institute
>E-Mail: [log in to unmask]
>Ph: (610) 362-1200 x208
>Fax: (610) 362-1290
>
>This message is for informational purposes only and does not supersede,
>modify, or create any agreements with ACI. Information contained in this
>message does not bind ACI or its affiliates to any commitment, either
>express or implied, unless ratified in writing by an authorized
>representative.
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Marsico, James
>Sent: Monday, January 26, 2004 9:12 AM
>To: [log in to unmask]
>Subject: Re: [TN] Lead-free Component Finishes
>
>
>I wasn't planning to make the change over to lead-free processing. Some
>concerns with the lead-free initiative are:
>1) I understand that some component manufacturers have started
>supplying lead-free finishes without changing the part numbers. If this
>is true, how will this impact my assembly process if I use PbSn solder?
>2) If I specify tin-lead finish, some parts may fall under the
>diminishing manufacturing source (DMS) management requirements. Will
>tin-lead finished be available down the road?
>
>Jim Marsico
>Senior Engineer
>Production Engineering
>EDO Electronics Systems Group
>[log in to unmask] <mailto:[log in to unmask]> 631-595-5879
>
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