Guenter, could you explain how the tin whisker problem is about to be
solved?

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879


        -----Original Message-----
        From:   Guenter Grossmann [SMTP:[log in to unmask]]
        Sent:   Thursday, January 22, 2004 11:14 AM
        To:     [log in to unmask]
        Subject:        [TN] Antw: [TN] Lead-free Component Finishes

        James

        1) BGA's SnAgCu
        Passive : Sn looks like the candidate specially since the whisker
        problem seems to be about to be solved
        IC's: Sn or PaAu

        2) BGA's: You can solder SnAgCu balls with SnPb. However, one can
        observe Pb contamination along the grain boundaries. Dave Surarski
        reported early failures due to that. I couldn't say jet. We are
        testing.
        All the other components can be soldered with SnPb without a
problem.

        3) Military is excluded of RoHS (at the moment). What do you mean
with
        commercial? Look for the RoHS in the web. I don't know the address
but
        Google finds it easy if you look for RoHS.


        Best regards

        Guenter



        EMPA
        Swiss Federal Laboratories  for Materials Testing and Research
        Centre for Reliability
        Guenter Grossmann,  Senior Engineer

        8600 Duebendorf
        Switzerland

        Phone: xx41 1 823 4279
        Fax :     xx41 1 823 4054
        mail:     [log in to unmask]

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