I wasn't planning to make the change over to lead-free processing. Some
concerns with the lead-free initiative are:
1) I understand that some component manufacturers have started
supplying lead-free finishes without changing the part numbers. If this is
true, how will this impact my assembly process if I use PbSn solder?
2) If I specify tin-lead finish, some parts may fall under the
diminishing manufacturing source (DMS) management requirements. Will
tin-lead finished be available down the road?
Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------