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January 2004

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Subject:
From:
"Marsico, James" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 26 Jan 2004 09:12:11 -0500
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I wasn't planning to make the change over to lead-free processing.  Some
concerns with the lead-free initiative are:
1)      I understand that some component manufacturers have started
supplying lead-free finishes without changing the part numbers.  If this is
true, how will this impact my assembly process if I use PbSn solder?
2)      If I specify tin-lead finish, some parts may fall under the
diminishing manufacturing source (DMS) management requirements.  Will
tin-lead finished be available down the road?

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879

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