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January 2004

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Subject:
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 22 Jan 2004 13:39:12 -0500
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text/plain (62 lines)
The Boeing paper was authored by Tom Woodrow.  His e-mail address is listed with an earlier Boeing lead free summary, so I don't think he would mind (I hope!) me giving it here.

Bev

[log in to unmask]

-----Original Message-----
From: Barr, Bob [mailto:[log in to unmask]]
Sent: January 22, 2004 1:07 PM
To: [log in to unmask]
Subject: Re: [TN] Lead-free Component Finishes


Re: Bi,

I am a little surprised to see Bi as a leading candidate. At a seminar I
attended, the subject of Bi in solder was discussed. I thought I heard that
Bi was meeting resistance, especially in Europe, because the environmental
issues with it were worse than the lead it was replacing. Not being a
chemist, I don't know which is worse from a landfill toxicity viewpoint -
2%Bi or 37%Pb. It is also quite possible I misunderstood what was said about
Bi! Is Bi as a component of solder an environmental concern?

Thanks.

=========================
Bob Barr
Manufacturing Engineering
Formation, Inc.
=========================

> -----Original Message-----
> From: Leo Higgins [mailto:[log in to unmask]]
> Sent: Thursday, January 22, 2004 12:07 PM
> To: [log in to unmask]
> Subject: Re: [TN] Lead-free Component Finishes
>
>
> In Japan most companies are moving towards Sn-Bi lead
> finishes (typically
> Sn-2Bi), ...message snipped...

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