James

1) BGA's SnAgCu
Passive : Sn looks like the candidate specially since the whisker
problem seems to be about to be solved
IC's: Sn or PaAu

2) BGA's: You can solder SnAgCu balls with SnPb. However, one can
observe Pb contamination along the grain boundaries. Dave Surarski
reported early failures due to that. I couldn't say jet. We are
testing.
All the other components can be soldered with SnPb without a problem.

3) Military is excluded of RoHS (at the moment). What do you mean with
commercial? Look for the RoHS in the web. I don't know the address but
Google finds it easy if you look for RoHS.


Best regards

Guenter



EMPA
Swiss Federal Laboratories  for Materials Testing and Research
Centre for Reliability
Guenter Grossmann,  Senior Engineer

8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :     xx41 1 823 4054
mail:     [log in to unmask]

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