Good Morning Jim,
First of all, check the archives, there has been multiple questions posed on
this topic.  I would also check the LeadFree forum archives.

The following finishes are what I've seen as of late:  80/20 SnPb, 85/15
SnPb, PdAg, NiPd, AgPtPd, 100Sn, and matte Sn.  The solution that has worked
to date is to use 62/36/2 SnPbAg solder paste and modify every CCA reflow
profile to remain above solder liquidus (~179°C) for a longer period of
time, not to exceed the paste mfr's recommendations.

Steve Sauer
Sr. Mfg Engineer
Northrop Grumman, Electronic Systems
Xetron 

-----Original Message-----
From: Marsico, James [mailto:[log in to unmask]]
Sent: Thursday, January 22, 2004 7:16 AM
To: [log in to unmask]
Subject: [TN] Lead-free Component Finishes


Hello Technet:
With the current world-wide initiative to eliminate lead from electronics
manufacturing, I'm assuming that the component manufactures are also making
the change.  What types of component lead finishes can I expect with the
transition to lead-free, and how would they impact an existing a tin-lead
process?

Also, is the European mandate to be lead-free by July 2006 a requirement for
only consumer products?  What about commercial or military?

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