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January 2004

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 22 Jan 2004 10:33:37 +0200
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Put it this way, Steve. Karl Dietz published his book "Dry Film
Photoresist Processing Technology" in 2001, with its sexy pink
dustcover. In the 430-odd pages, there are a few mentions of solder
masking in Chapter 1 with a solid implication that it has been
supplanted entirely by LPI. Dr Dietz is pretty high up in the company
that introduced dry film technology, including solder masks, to the
world. Need one say more?

Brian

Steve Gregory wrote:

> Can anybody tell me why dry film solder masks are still specified?
>
> I don't want to hear; "Because they've always worked good..."
>
> But some clear, concise, reasons for specifying them...
>
> Vacuum at ICT is a dead deal, there are ways to deal with open via's with
> LPI's...Solder fill for via's is a dead deal...either you fill them, or you don't.
>
> So why dry-films?
>
> So many complications come up with dry film solder masks...
>
> Not only for the bare board manufacturer...but also for the assembler.
>
> Just a question...(for the DoD guys, especially)
>
> -Steve Gregory-
>
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