Can anybody tell me why dry film solder masks are still specified?
I don't want to hear; "Because they've always worked good..."
But some clear, concise, reasons for specifying them...
Vacuum at ICT is a dead deal, there are ways to deal with open via's with
LPI's...Solder fill for via's is a dead deal...either you fill them, or you don't.
So why dry-films?
So many complications come up with dry film solder masks...
Not only for the bare board manufacturer...but also for the assembler.
Just a question...(for the DoD guys, especially)
-Steve Gregory-
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