TECHNET Archives

January 2004

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
David Douthit <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 21 Jan 2004 10:06:18 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (56 lines)
Bogert,

Sandia National Labs issued a report Dec. 2000 titled:

> Physical Models for Predicting the
> Effect of Atmospheric Corrosion on
> Microelectronic Reliability
> N. Robert Sorensen, Jeffrey W. Braithwaite and Samuel J. Lucero
> Corrosion Science & Technology Department
>
> Sandia National Laboratories
> P.O. Box 5800
> Albuquerque, NM 87185-0888

This 88 page report covers wire bond problems involving plastic
encapsulated microcircuits in relation to water vapor( humidity
exposure) plus various levels and types of airborne contamination.
It is quite interesting. I have it in pdf format if you would like a copy.

David A. Douthit
Manager
LoCan LLC
==================================


Bogert wrote:

>January 21, 2004
>
>Folks, although this question may not be appropriate for this forum, does anyone out there have any information or technical data regarding internal bond-wire failures in non-hermetic integrated circuits (IC).  It is my understanding that this is a recently uncovered problem where the internal bonds in IC''s are failing open due to presence of molecular moisture in the IC, or by outside contamination sources (e.g.
>---------------------------------------------------
>Technet Mail List provided as a service by IPC using LISTSERV 1.8e
>To unsubscribe, send a message to [log in to unmask] with following text in
>the BODY (NOT the subject field): SIGNOFF Technet
>To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
>To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
>Search the archives of previous posts at: http://listserv.ipc.org/archives
>Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
>-----------------------------------------------------
>copper).
>
>
>
>


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2