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January 2004

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Subject:
Re: Celeco CP Direct plating process
From:
Donald Vischulis <[log in to unmask]>
Reply To:
Donald Vischulis <[log in to unmask]>
Date:
Mon, 19 Jan 2004 11:00:59 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (52 lines) 
Pankaj

I've used direct plate, but not this particular chemistry.  In general, direct plate is capable of providing high reliability plated thru holes.  There are differences in performance between plated thru holes based on electroless copper and direct plate.  As with any new process, it is important that the board fabricator validate and qualify the new process.  Process control is generally not as complicated for direct plate, but it is still critical to achieve a quality plated hole.

Don Vischulis

-----Original Message-----
From: "Karnwal, Pankaj" <[log in to unmask]>
Sent: Jan 18, 2004 9:55 PM
To: [log in to unmask]
Subject: [TN] Celeco CP Direct plating process

        Dear Techneters
        We have received a communication from our local PCB supplier about
change in Electro-Less Copper plating process to a new process "Celeco CP
Direct plating process from Atotech"

      Can anybody tell me that what is the difference between and, is it the
new process  better, any  risk factor
to adopt this technology. Any experience ???

Pankaj Karnwal
Jr. Engineer QA

Barco Electronics System  (P) Ltd.
Plot no. A - 4 & 5, Sector- 5
G.B Nagar, Noida  - 201301
India
Fax.+91-120-2421691
mailto:[log in to unmask]


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