hi all,

We are facing a very peculiar problem on our line. The problem is of lifted lead found on the IC leads. The package is both tape & reel and tray.

We have verified the placement pressure,nozzle condition,pick-up for our machines. This all is in good condition.

Also we tried to check the incoming material, but is quite difficult to verify and we have not been able to find much there. Tried the co-planarity check also but is ok.

On the human side we are trying to stop tray to tray transfers of ICs & identifying all the rework ICs.

But still we are encountering this issue of lifted lead........  Guys i need your help and some creative ideas( both on machine side and human side) that we can implememnt online to breakthrough this problem.

looking forward to response from you all.

Have a nice day.

rgds
Prashant Chopra
Process Engineer
JABIL CIRCUITS


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