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January 2004

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 16 Jan 2004 10:10:29 -0500
Content-Type:
text/plain
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text/plain (33 lines)
That is a big hole. IPC-2221 and IPC-2222. What product class are you
building. Clinch and standoff will be an issue, for class 3. J-STD-001
and IPC-A-610.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Macko, Joe @ IEC
> Sent: Thursday, January 15, 2004 5:01 PM
> To: [log in to unmask]
> Subject: [TN] Annular solder land size
>
>
> Tech Nets,
>
> Good afternoon.
>
> What IPC spec addresses what the recommended annular ring
> solder land size s/b as well as hole diameter to insert and
> solder a .019" lead/pin?  The .019" diameter pin going into
> the non plated through hole has a .060" diameter shoulder to
> solder to the solder land.  thanks
>
> joe

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