For small FC builds we used to dry @105-110degC for at least 2 hours.
I've been told that you need to pull at least 27 inches of mercury to
attain the required vacuum. The Universal Consortium mentioned this
technique in some detail maybe 4 years ago in one of their
presentations.    I think that Dan Blass was the author/presenter.

Rich Kraszewski 
Advanced Manufacturing Engineer - KEDS
Phone:  812.634.4281
Pager:  812.481.3492
 
 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gabriela Bogdan
Sent: Friday, January 16, 2004 1:20 AM
To: [log in to unmask]
Subject: Re: [TN] MSD Question


Does anybody in this forum dry the components in a vacuum oven? Are
there any time and vacuum suggestions? What about old printed circuits
or assemblies when preparing to replace BGAs? Gaby
----- Original Message -----
From: "Dave Hillman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, January 15, 2004 5:53 PM
Subject: Re: [TN] MSD Question


> Hi Don! Here's a quick answer - if the Sn/Pb component finish is not 
> sufficiently thick you will run the risk of degrading the 
> solderability - the higher the bake temperature the quicker/greater 
> the degradation. Good Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
>                       Donald Vischulis
>                       <dvischulis@earth        To:
[log in to unmask]
>                       link.net>                cc:
>                       Sent by: TechNet         Subject:  [TN] MSD
Question
>                       <[log in to unmask]>
>
>
>                       01/14/2004 08:26
>                       PM
>                       Please respond to
>                       Donald Vischulis
>
>
>
>
>
>
> Just a quick question:  What is your opinion of a MSD control 
> procedure
the
> requires baking tin/lead terminated (coated) components every 7 days?
>
> Don Vischulis
>
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