Does anybody in this forum dry the components in a vacuum oven?
Are there any time and vacuum suggestions?
What about old printed circuits or assemblies when preparing to replace
BGAs?
Gaby
----- Original Message -----
From: "Dave Hillman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, January 15, 2004 5:53 PM
Subject: Re: [TN] MSD Question
> Hi Don! Here's a quick answer - if the Sn/Pb component finish is not
> sufficiently thick you will run the risk of degrading the solderability -
> the higher the bake temperature the quicker/greater the degradation. Good
> Luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
> Donald Vischulis
> <dvischulis@earth To: [log in to unmask]
> link.net> cc:
> Sent by: TechNet Subject: [TN] MSD Question
> <[log in to unmask]>
>
>
> 01/14/2004 08:26
> PM
> Please respond to
> Donald Vischulis
>
>
>
>
>
>
> Just a quick question: What is your opinion of a MSD control procedure
the
> requires baking tin/lead terminated (coated) components every 7 days?
>
> Don Vischulis
>
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