Hello,
for years, we have been using Indium's 51C, RMA solder paste. We have
struggled for years to clean off all the paste residue that is left behind,
especially that left under tight fitting components. Because we are a
NASA/Govt manufacture, we have always used RMA paste and cleaned with
solvent to remove residue. All of our assemblies have to meet the IPC
cleanliness requirements, and some customers want to take it a step further
and meet the NASA out gassing requirements as well.   Because we have
problems with trapped flux under some components, Indium has recommended
that we switch to their 92H paste. This RMA paste is classified as a No
Clean, but has a Rosin base that cleans well with solvents. The cleaner
that I use is a Detrex (in line spray under immersion) cleaner and the
solvent is Kyzen’s I-3330.  I would like to know if anyone else has been
using this combination and if you had any problems qualifying the solder
paste?  Is there any qualifying data for solder-ability or cleaning
available for this combination that someone would be able to share?  Any
help here would be appreciated.
Thanks in advance,
Jack

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