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January 2004

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Subject:
From:
Lum Wee Mei <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 6 Jan 2004 15:45:07 +0800
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Hello,

I have asked Steve to download the picture at his site. Once it ready,
can someone take a look and give me your opinion what is the likely cause.

Background : The board was partially mounted previously.  It come back
to mount the remaining 6 chips. The board was washed as per normal with
Ensolv and assembled immediately.  As the operator solder the chip, she
noticed scale-like defects appearing on the soldemask around the whole
stretch of the solder pads. The defects are more prominent on the left
side compare to right of the chip. This is repeated for the rest of the
5 chips.

Being naughty, she touched the board surface with the soldering iron tip
and found on the same spot the same defect appearing.

One more information : defects found on these 2 boards have a much more
rough surface compare to other pieces within the same batch.

How the information is sufficent for you to provide opinions.

Thanks and regards,
Wee Mei

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