Contact Information:
Joe Dudeck, IPC Communications Manager
P: 847-790-5371
E: [log in to unmask]
For Immediate Release
IPC and JEDEC Leading the Way to Lead Free
NORTHBROOK, Ill., January 14, 2004--IPC-Association Connecting
Electronics Industries* and JEDEC, the Solid State Technology
Association, have announced plans to further their efforts in preparing
electronics manufacturers for the inevitable European ban on lead by
co-sponsoring three International Conferences on Lead Free Electronic
Components and Assemblies in the U.S., Europe and Asia in 2004.
Ever since the European Union agreed upon the Restriction of Hazardous
Substances in Electrical and Electronic Equipment Directive, in which
all affected electrical equipment sold in Europe after July 1, 2006,
must be free of lead, IPC and JEDEC have taken an active role in keeping
the industry informed of changing requirements and encouraging the
voluntary elimination of lead. In just its second year of jointly
producing domestic and international conferences on lead free
electronics, IPC and JEDEC will host their 5th, 6th and 7th lead free
conferences on March 17-19, 2004, in San Jose, Calif.; in August 2004 in
Singapore and on October 20-22, 2004, in Frankfurt, Germany.
"With just over two years to go until the European deadline, no topic is
hotter in the global electronics industry than lead free technology,"
said David Bergman, IPC's vice president of standards, technology and
international relations. "Our first four conferences have informed
thousands of individuals from all segments of the supply chain on the
widespread implications of this deadline.
JEDEC President John Kelly added: "We're excited about addressing the
vital issues concerning lead elimination and presenting the data on lead
free alternatives through these upcoming forums."
Each international conference provides tutorials focusing on such
subjects as manufacturing with lead free, halogen free and conductive
adhesive materials, as well as various workshops that, among other
things, introduce lead free solders and present selection criteria for
lead free compositions.
IPC and JEDEC also select elite industry experts to present a two-day
technical conference covering crucial lead free topics. Presently,
Conference Chairs Jean Hebeisen and David Bergman of IPC and John Kelly
and Donna McEntire of JEDEC are seeking papers and presentations
pertaining to the following areas:
* Policy-European lead ban status
* EMS Industry-On the front line of the change
* Component issues (passives and actives)
* Design issues
* Environmental health and safety effects and alternatives
* PCB issues
* OEM/Consumer demands/voluntary elimination dates
* Recycling options
* Substitution-New commercially available alloys/conductive
adhesives/ease of replacement
* Cost issues
* Reliability evaluations (e.g., temperature cycling data, tin
whiskers)
* Roadblocks to implementation
* Finishes issues-Organic solder protectants, immersion tin,
silver, electroless nickel, palladium, etc.
* Lead free and other product sectors (automotive, aerospace, etc.)
Each International Conference on Lead Free Electronic Components and
Assemblies will offer 30- to 45-minute time slots for papers and
presentations in both forum or panel discussion formats. Presentation
materials and papers should be noncommercial in nature, focusing on
technology. To deliver an oral presentation, it is mandatory to provide
a print-quality paper or hard copies of visuals for the conference
proceedings. Previously published papers and papers focused on a
company's products will not be accepted.
Abstracts summarizing original and previously unpublished work and
covering case histories, research and discoveries should be
approximately 200-300 words long and include a brief biography. The
deadlines for abstract submissions are as follows:
* San Jose.......January 23, 2004
* Singapore......May 28, 2004
* Frankfurt......July 30, 2004
If an abstract is accepted, paper submissions must be received by:
* San Jose........February 27, 2004
* Singapore......July 23, 2004
* Frankfurt......September 24, 2004
Top PCB suppliers are also welcome to showcase their products and
services at the conference. For more information about sponsorship
opportunities or reserving tabletop exhibit space, contact Alexandra
Curtis, IPC's continuing education manager, at 847-790-5377 or
[log in to unmask]
For more information, contact Bergman at [log in to unmask] or
847-790-5340, or McEntire at [log in to unmask] or 703-907-7516.
About JEDEC
JEDEC is the world's leading standards development organization for the
semiconductor industry. Eighteen hundred representatives of some
275-member companies actively participate on 50 committees, developing
standards to meet the needs of every segment of the industry. JEDEC is
a founding sector of the Electronic Industries Alliance (EIA) that
represents 2,100 companies in all areas of the electronics industry.
For more information about JEDEC, visit www.jedec.org
<http://www.jedec.org/> .
About IPC
IPC is a Northbrook, Ill.-based trade association dedicated to the
competitive excellence and financial success of its more than 2,200
member companies, which represent all facets of the electronic
interconnection industry, including design, printed circuit board
manufacturing and electronics assembly. As a member-driven organization
and leading source for industry standards, training, market research and
public policy advocacy, IPC supports programs to meet the needs of a $40
billion U.S. industry employing more than 350,000 people. IPC maintains
additional offices in Taos, N.M.; Washington, D.C.; Garden Grove,
Calif.; The Netherlands; and Shanghai, China. For more information,
visit www.ipc.org <http://www.ipc.org/> .
//30//
NR04003IPC/JEDECLeadFree
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