Hi Bill how do you like CO? Ft. Collins is a nice area. Probably warmer
there right now then here in NH. Actually they said that it is warmer at the
S.Pole then in NH right now!

In regards to the solder mask issue. Steve has seen these types of problems
in the past.
Flaking, white & gray stains etc. Once I believe there was a problem on only
25 boards from a lot of a few hundred.
A quick search of the TN archives will confirm. I believe the root cause is
usually traced to the board level fab.
Your input on test methods etc. is all great info. How many CM's and OEMs
actually know of this being performed or monitored at their board suppliers?
Perhaps a work shop at an IPC event should be in the works?

Aquanox XJN and XJN+ products are in use successfully in many companies and
facilities. The majority being defense and space related.
This surely covers the range of popular solder masks in use today.
In addition XJN has been tested for compatibility at a major UK supplier.
This test proves that a successful UV bump is needed to avoid any
delaminating. Even with only HOT water applied.
The wash process at LaBarge has only exposed the defect from the solder mask
application.
A related thread shows similar problems with an nPb product at use in
Singapore. With the boil temp around 160F, past testing has shown that
solder masks defects such as white/gray staining etc. usually spring up when
wash temps of aqueous and vapor products approach this range. A secondary UV
bump can usually eliminate this.
Not to say that all dry and LPI masks are chemically compatible. There has
on rare occasion been one or two that has surfaced but it has been many,
many years since I have seen a true incompatible issue surface.
Steve, please call or keep me posted on the current issue.
Bill take care, hope all is well on the home front.

Sincerely,

Charlie Pitarys
Director of Application Technologies
603.622.2900 X-115







-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of [log in to unmask]
Sent: Tuesday, January 13, 2004 7:08 PM
To: [log in to unmask]
Subject: Re: [TN] "Snake Board"...


Steve-
1. Did you try the methylene chloride test (IPC Test Method) to look for
degree of cure?
2. To check for organics on the copper surface (could be from plating bath)
the organic contaminant check is quick and inexpensive (IPC TM-650 2.3.38;
Trace Labs used to sell test kits to do this test).
3. If there is a UV cure involved, are the UV lights monitored for output?
Had a residue problem after soldering at DEC, found their UV lights were low
in
output, ran scrap solder masked PWBs through the cure step until they
passed.
Took 3 passes to get enough UV from the dying lamps!!
4. Has Kyzen offered any suggestions as to the problem and possible
solution?

Bill Kenyon
Global Centre Consulting
3336 Birmingham Drive
Fort Collins, CO   80526
Tel: 970.207.9586     Cell: 302.377.4272

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