Luis
We have found that voiding / pin holes over Ag surface finishes can be quite
common.
These problems can also be exhaserbated by the thickness of the plating, the
age of the boards as well as the method/conditions they were stored in.
There are several successful process options available for the elimination
of said defects, which I would be happy to share.
Please feel free to contact me offline.
Regards
Jim Wertin
Technical Applications Manager
AIM, Inc.
[log in to unmask]
401-463-5605
Date: Mon, 26 Jan 2004 10:02:21 -0600
From: Luis Gallegos <[log in to unmask]>
Subject: PBGA Void/pin holes
Good morning Technetters.
I am having some occasionally voids/pin holes on our PBGA. We are currently
using NC293 Sn63/Pb37 Aim solder paste. The board is silver plated. Printing
with a 6 mil stencil.
Is it normal to have occasionally voids?
We have bake our PBGA's prior to reflow, and also work with the oven
profile. Any suggestions.
Thank you
Luis A Gallegos
Automation Senior Technician
SANMINA-SCI
Pleasant Prairie WI
Phone: 262 947-7700
[log in to unmask]
----- Original Message -----
From: "Automatic digest processor" <[log in to unmask]>
To: "Recipients of TechNet digests" <[log in to unmask]>
Sent: Tuesday, January 27, 2004 1:00 AM
Subject: TechNet Digest - 25 Jan 2004 to 26 Jan 2004 (#2004-24)
> There are 24 messages totalling 1828 lines in this issue.
>
> Topics of the day:
>
> 1. No Of PCB/PWB Rework (2)
> 2. Subject: Re: [TN] Equivalence between IPC-A-600 and BS 123200 & BS
123300
> ?
> 3. B.E.S.T. Inc
> 4. Soaking Circuit Boards in Alcohol
> 5. Lead-free Component Finishes (4)
> 6. CID Allegro Designer Needed
> 7. Antw: [TN] Lead-free Component Finishes (3)
> 8. PBGA Void/pin holes (4)
> 9. 0402 SOLDERING (2)
> 10. Tape and Reel MFG. (3)
> 11. Board rework (2)
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ----------------------------------------------------------------------
>
> Date: Mon, 26 Jan 2004 06:18:51 -0600
> From: Victor Hernandez <[log in to unmask]>
> Subject: No Of PCB/PWB Rework
>
> Fellow TechNetters:
>
> What is IPC Standards guideline for the number of time PTH Components
can
> be rework
> without compromising the Product QUALITY and Reliability of the product.
> Many times
> the product can not be sold as NEW with an X number of components
> replacement. It
> can be sold as EQUAL To NEW. In a previous life we used # as the magic
> number.
>
>
> Victor,
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 12:36:25 +0000
> From: Graham Naisbitt <[log in to unmask]>
> Subject: Subject: Re: [TN] Equivalence between IPC-A-600 and BS 123200 &
BS 123300 ?
>
> Hello Techies
>
> Sorry to Luc that this posting was rejected because I sent it from my home
> address.
>
> So belatedly....
>
> > Luc
> >
> > Can you get your client to send you a copy of the front page of the
British
> > Standard? This will state whether the BS document is referencing an ISO
or
> > IEC standard and you need those reference numbers.
> >
> > Check with IPC/ANSI if the A-600F is integrated with an International
> > Standard or not.
> >
> > If it isn't, then you will need to get copies of the British Standard
that
> > your client should be able to do for you. It might cost. A useful web
site
> > is http://bsonline.techindex.co.uk or you can visit
> > http://www.bsi-global.com
> >
> > Hope this helps
> > --
> > Regards Graham Naisbitt
> >
> > [log in to unmask]
> >
> > Cell: 079 6858 2121
> > Office: +44 (0)1252 813706
> >
> > Concoat Limited - Engineering Reliability in Electronics
> >
> > NEW - HumiSeal 1H2O Bov Aerosol - NEW
> >
> > Web: www.concoat.co.uk and www.concoatsystems.com
> >
> >
> >> Is there some comparison made between the ANSI/IPC-A-600F and the
British
> >> Standard BS 123200:2001 and BS 123300:2001 for the manufacturing of PWB
and
> >> between ANSI/IPC-610C and BS 123000:2001?
> >>
> >> I have a European client that requires me to be compliant to the
British
> >> Standard and my boards are manufactured according to IPC Standard.
> >>
> >> Are these standards equivalent?
> >>
> >> Thanks!
> >>
> >> Luc Baril, P. Eng.
> >> Systems Engineer.
> >> Vapor Rail Inc.
> >> 10 655 Henri-Bourassa West
> >> Saint-Laurent, Quebec, H4S 1A1
> >> Phone : 514-335-4200 ext.2082 Fax : 514-335-4231
> >> Email : [log in to unmask]
> >> WEB : www.vaporrail.com & www.wabtec.com
> >>
> >> ---------------------------------------------------
> >> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> >> To unsubscribe, send a message to [log in to unmask] with following text
in
> >> the BODY (NOT the subject field): SIGNOFF Technet
> >> To temporarily halt or (re-start) delivery of Technet send e-mail to
> >> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> >> To receive ONE mailing per day of all the posts: send e-mail to
> >> [log in to unmask]: SET Technet Digest
> >> Search the archives of previous posts at:
http://listserv.ipc.org/archives
> >> Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> >> for
> >> additional information, or contact Keach Sasamori at [log in to unmask] or
> >> 847-509-9700 ext.5315
> >> -----------------------------------------------------
> >>
> >
> > ---------------------------------------------------
> > Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> > To unsubscribe, send a message to [log in to unmask] with following text
in
> > the BODY (NOT the subject field): SIGNOFF Technet
> > To temporarily halt or (re-start) delivery of Technet send e-mail to
> > [log in to unmask]: SET Technet NOMAIL or (MAIL)
> > To receive ONE mailing per day of all the posts: send e-mail to
> > [log in to unmask]: SET Technet Digest
> > Search the archives of previous posts at:
http://listserv.ipc.org/archives
> > Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
> > additional information, or contact Keach Sasamori at [log in to unmask] or
> > 847-509-9700 ext.5315
> > -----------------------------------------------------
> >
> >
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 07:12:24 -0600
> From: "Kasica, David (MED, GEMS-IT)" <[log in to unmask]>
> Subject: Re: B.E.S.T. Inc
>
> Carl, we do alot of work with B.E.S.T they do some great work. If you
> would like to talk about this company off line please call me.
>
> Dave Kasica
>
> GE Medical Systems
> Information Technologies
> ____________________________
> David Kasica
> GEC Manufacturing Engineering
> 8200 W. Tower Ave.
> Milwaukee, WI 53223
> Phone: (414) 362-2494
> Fax: (414) 362-3258
> Email: [log in to unmask]
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Carlr Ray
> Sent: Friday, January 23, 2004 3:36 PM
> To: [log in to unmask]
> Subject: [TN] B.E.S.T. Inc
>
>
> Any of you every had any experience with a B.E.S.T. Inc? They are out of
> Rolling Meadows Illinois. They specialize in rework/ repair of
> electronic assemblies.
> Any info or feedback would be great!!
>
>
> ===============================
> Carl Ray
> Sr. Manufacturing Engineer
> 13000 S. Memorial Parkway
> Huntsville, AL 35807
> Desk: 256-882-4800 ext. 8845
> Fax: 256-882-4082
> Cell: 256-990-1990
> [log in to unmask]
> ===============================
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text
> in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at:
> http://listserv.ipc.org/archives
> Please visit IPC web site
> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 08:43:59 -0500
> From: "Marsico, James" <[log in to unmask]>
> Subject: Re: Soaking Circuit Boards in Alcohol
>
> We clean our PWB assemblies prior to conformal coating by submersing in a
> solution of 75% N-PROPANOL and 25% DI water at 125 degrees F for 2 hours.
> Never had an Ionograph failure.
>
> Jim Marsico
> Senior Engineer
> Production Engineering
> EDO Electronics Systems Group
> [log in to unmask] <mailto:[log in to unmask]>
> 631-595-5879
>
>
> -----Original Message-----
> From: Schleman, Joe A. [SMTP:[log in to unmask]]
> Sent: Friday, January 23, 2004 11:40 AM
> To: [log in to unmask]
> Subject: [TN] Soaking Circuit Boards in Alcohol
>
> Hi,
> I happened to observe somebody soaking some assembled boards in
> isopropyl
> alcohol to clean them. I was wondering if this was an acceptable
> method for
> cleaning. I know using alcohol to clean is okay but, I'm not so
sure
> about
> actually soaking the whole assembly in an alcohol bath. Any
Insight
> would be
> appreciated. Thanks.
>
> Joe
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following
> text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail
to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at:
> http://listserv.ipc.org/archives
> Please visit IPC web site
> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information,
> or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 09:12:11 -0500
> From: "Marsico, James" <[log in to unmask]>
> Subject: Re: Lead-free Component Finishes
>
> I wasn't planning to make the change over to lead-free processing. Some
> concerns with the lead-free initiative are:
> 1) I understand that some component manufacturers have started
> supplying lead-free finishes without changing the part numbers. If this
is
> true, how will this impact my assembly process if I use PbSn solder?
> 2) If I specify tin-lead finish, some parts may fall under the
> diminishing manufacturing source (DMS) management requirements. Will
> tin-lead finished be available down the road?
>
> Jim Marsico
> Senior Engineer
> Production Engineering
> EDO Electronics Systems Group
> [log in to unmask] <mailto:[log in to unmask]>
> 631-595-5879
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 10:38:31 -0500
> From: Lee Whiteman <[log in to unmask]>
> Subject: Re: Lead-free Component Finishes
>
> Jim,
>
> 1. ACI built hardware with SnPb solders, using components finished with
> Lead Free finishes (Sn, Pd, NiPd, etc.) for the Lead Free Components
> Focus Group and our own internal Lead Free Projects, and found no
> incompatibilities. Of course, the metallurgy of the solder joint was
> different than what you would expect with SnPb finishes.
>
> 2. My gut tells me that sooner or later (~ 2006 timeframe), SnPb
> finishes will no longer be available in the long term. As the conversion
> from SnPb to Lead Free continues, the availability of components
> finished with SnPb will decrease. IMHO, the component market requirement
> for SnPb finished components will not be sufficiently large enough to
> have component manufacturers support both a SnPb and Lead Free
> production line for the same electronic package. Of course this also
> depends on the type of packages (chip components vs. leaded SMT devices
> vs. etc.).
>
> Hope this helps.
>
> Good Luck.
>
> Lee Whiteman
> Senior Manufacturing Engineer
> American Competitiveness Institute
> E-Mail: [log in to unmask]
> Ph: (610) 362-1200 x208
> Fax: (610) 362-1290
>
> This message is for informational purposes only and does not supersede,
> modify, or create any agreements with ACI. Information contained in this
> message does not bind ACI or its affiliates to any commitment, either
> express or implied, unless ratified in writing by an authorized
> representative.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Marsico, James
> Sent: Monday, January 26, 2004 9:12 AM
> To: [log in to unmask]
> Subject: Re: [TN] Lead-free Component Finishes
>
>
> I wasn't planning to make the change over to lead-free processing. Some
> concerns with the lead-free initiative are:
> 1) I understand that some component manufacturers have started
> supplying lead-free finishes without changing the part numbers. If this
> is true, how will this impact my assembly process if I use PbSn solder?
> 2) If I specify tin-lead finish, some parts may fall under the
> diminishing manufacturing source (DMS) management requirements. Will
> tin-lead finished be available down the road?
>
> Jim Marsico
> Senior Engineer
> Production Engineering
> EDO Electronics Systems Group
> [log in to unmask] <mailto:[log in to unmask]> 631-595-5879
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
> unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
> (re-start) delivery of Technet send e-mail to [log in to unmask]: SET
> Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
> posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
> archives of previous posts at: http://listserv.ipc.org/archives Please
> visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
> additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 10:34:21 -0500
> From: Greg Goodenbury <[log in to unmask]>
> Subject: Re: CID Allegro Designer Needed
>
> Good Morning V,
>
> My company is an Allegro service bureau and I have 6 Senior Allegro
> designers currently on staff. Please pass my contact information on to =
> the
> company looking to contract work.
>
> Thank you,
>
> Greg Goodenbury
>
> Conquest Technology, Inc. =20
> 1500 Town Plaza Ct =20
> Winter Springs, FL 32708-6224
> Voice: 407-359-1919
> Fax: 407-359-1918
> E-Mail: [log in to unmask]
> Web Page: http://www.conquestpcb.com=20
>
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of =
> [log in to unmask]
> Sent: Friday, January 23, 2004 5:00 PM
> To: [log in to unmask]
> Subject: [TN] CID Allegro Designer Needed
>
> Does anyone in the group know an Allgro designer with an IPC =
> Certification?
> There is a company here in my area looking for someone to do some =
> Allegro
> work.
> Remote contract work is available if you are not in the area, and two
> Allegro
> full-time positions available if you are in the area.
>
> I just happen to know that the pay is good, and they are willing to =
> provide
> a
> license and in some cases hardware to work off-site if needed. I'd jump =
> the
> opportunity myself, but I can't in good conscience call myself an =
> "Allegro"
> designer. I am a Mentor guy.
>
> I was asked not to blast the company's name, contact information out, so
> please don't ask. But if you are an Allegro designer, or you know of =
> one.
> Please
> send me your information (Full name, email address and/or contact =
> number at
> the very least), and I will pass it on for them to contact you.
>
> By the way, I also happen to know that the CID is not a must, but is a =
> plus
> with these guys, so let it be known if you ARE certified.
>
> V
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text =
> in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: =
> http://listserv.ipc.org/archives
> Please visit IPC web site =
> http://www.ipc.org/contentpage.asp?Pageid=3D4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] =
> or
> 847-509-9700 ext.5315
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=3D4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 10:36:17 -0500
> From: "Marsico, James" <[log in to unmask]>
> Subject: Re: Antw: [TN] Lead-free Component Finishes
>
> Guenter, could you explain how the tin whisker problem is about to be
> solved?
>
> Jim Marsico
> Senior Engineer
> Production Engineering
> EDO Electronics Systems Group
> [log in to unmask] <mailto:[log in to unmask]>
> 631-595-5879
>
>
> -----Original Message-----
> From: Guenter Grossmann [SMTP:[log in to unmask]]
> Sent: Thursday, January 22, 2004 11:14 AM
> To: [log in to unmask]
> Subject: [TN] Antw: [TN] Lead-free Component Finishes
>
> James
>
> 1) BGA's SnAgCu
> Passive : Sn looks like the candidate specially since the whisker
> problem seems to be about to be solved
> IC's: Sn or PaAu
>
> 2) BGA's: You can solder SnAgCu balls with SnPb. However, one can
> observe Pb contamination along the grain boundaries. Dave Surarski
> reported early failures due to that. I couldn't say jet. We are
> testing.
> All the other components can be soldered with SnPb without a
> problem.
>
> 3) Military is excluded of RoHS (at the moment). What do you mean
> with
> commercial? Look for the RoHS in the web. I don't know the address
> but
> Google finds it easy if you look for RoHS.
>
>
> Best regards
>
> Guenter
>
>
>
> EMPA
> Swiss Federal Laboratories for Materials Testing and Research
> Centre for Reliability
> Guenter Grossmann, Senior Engineer
>
> 8600 Duebendorf
> Switzerland
>
> Phone: xx41 1 823 4279
> Fax : xx41 1 823 4054
> mail: [log in to unmask]
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following
> text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail
to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at:
> http://listserv.ipc.org/archives
> Please visit IPC web site
> http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information,
> or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 09:37:10 -0600
> From: Mel Parrish <[log in to unmask]>
> Subject: Re: No Of PCB/PWB Rework
>
> Hi Victor,
> The reference I recall for the number of allowable rework operations for =
> a given assembly was MIL-C-28809. That being customer and contract =
> driven makes it a little simpler to impose than IPC references which =
> cover many product definitions. There were others, such as WS-6536 which =
> required disposition after a single rework attempt for individual =
> connections. That reference being based as I recall upon the number of =
> thermal excursions that the printed circuit should be expected to endure =
> without reliability impact more so than the component considerations you =
> mentioned.=20
> Often the resulting product disposition would transition between the =
> definition of Rework as opposed to Repair which required further =
> contractual considerations such as price, or use restrictions such as =
> non-flight.=20
>
> Mel Parrish
> Madison, AL
> 256 705 5530
> [log in to unmask]
> www.solderingtech.com
> =20
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Victor Hernandez
> Sent: Monday, January 26, 2004 6:19 AM
> To: [log in to unmask]
> Subject: [TN] No Of PCB/PWB Rework
>
>
> Fellow TechNetters:
>
> What is IPC Standards guideline for the number of time PTH Components =
> can
> be rework
> without compromising the Product QUALITY and Reliability of the product.
> Many times
> the product can not be sold as NEW with an X number of components
> replacement. It
> can be sold as EQUAL To NEW. In a previous life we used # as the magic
> number.
>
>
> Victor,
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text =
> in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to =
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to =
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: =
> http://listserv.ipc.org/archives
> Please visit IPC web site =
> http://www.ipc.org/contentpage.asp?Pageid=3D4.3.16 for additional =
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 =
> ext.5315
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=3D4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 10:02:21 -0600
> From: Luis Gallegos <[log in to unmask]>
> Subject: PBGA Void/pin holes
>
> Good morning Technetters.
> I am having some occasionally voids/pin holes on our PBGA. We are
currently
> using NC293 Sn63/Pb37 Aim solder paste. The board is silver plated.
Printing
> with a 6 mil stencil.
> Is it normal to have occasionally voids?
> We have bake our PBGA's prior to reflow, and also work with the oven
> profile. Any suggestions.
> Thank you
>
> Luis A Gallegos
> Automation Senior Technician
> SANMINA-SCI
> Pleasant Prairie WI
> Phone: 262 947-7700
> [log in to unmask]
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 17:38:38 +0100
> From: Guenter Grossmann <[log in to unmask]>
> Subject: Re: Antw: [TN] Lead-free Component Finishes
>
> Jim
>
> I was talking last week with a person from Motorola Germany and a
> someone from Collini. In the discussion both told me that by using a Ni-
> underplate and with the appropriate plating chemistry they don't' see
> problems with whiskers anymore. Earlier, in a conference from
> Electrosuisse, I had a discussion with a speaker talking about whisker
> growth as a function of grain size of the Sn plating which can be
> controlled with the appropriate chemistry and process parameters. What I
> learned in these discussion was that whiskers are a problem that can be
> controlled. In the worst case, in my understanding, it's a question of
> money. Annealing the plating can reduce the internal stress in the
> plating and diminish whisker growth.
> Wrong?
>
> Best regards
>
> Guenter
>
>
>
> EMPA
> Swiss Federal Laboratories for Materials Testing and Research
> Centre for Reliability
> Guenter Grossmann, Senior Engineer
>
> 8600 Duebendorf
> Switzerland
>
> Phone: xx41 1 823 4279
> Fax : xx41 1 823 4054
> mail: [log in to unmask]
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 11:43:45 -0500
> From: "Wenger, George M." <[log in to unmask]>
> Subject: Re: PBGA Void/pin holes
>
> Luis,
>
> How thick is your silver plating on your boards?
>
> Regards,
> George
>
> George M. Wenger (908)-546-4531=20
> Reliability Engineer
> RF Power Amplifier Group
> Andrew Corporation, 40 Technology Drive, Warren, NJ 07059
> [log in to unmask]
>
>
>
> -----Original Message-----
> From: Luis Gallegos [mailto:[log in to unmask]]
> Sent: Monday, January 26, 2004 11:02 AM
> To: [log in to unmask]
> Subject: [TN] PBGA Void/pin holes
>
>
> Good morning Technetters.
> I am having some occasionally voids/pin holes on our PBGA. We are
currently
> using NC293 Sn63/Pb37 Aim solder paste. The board is silver plated.
Printin=
> g
> with a 6 mil stencil.
> Is it normal to have occasionally voids?
> We have bake our PBGA's prior to reflow, and also work with the oven
> profile. Any suggestions.
> Thank you
>
> Luis A Gallegos
> Automation Senior Technician
> SANMINA-SCI
> Pleasant Prairie WI
> Phone: 262 947-7700
> [log in to unmask]
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
Listse=
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
Listserv@ip=
> c.org: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=3D4.3.1=
> 6 for additional information, or contact Keach Sasamori at [log in to unmask]
o=
> r 847-509-9700 ext.5315
> -----------------------------------------------------
>
> --------------------------------------------------------------------------
-=
> ---------------------
> This message is for the designated recipient only and may
> contain privileged, proprietary, or otherwise private information. =20
> If you have received it in error, please notify the sender
> immediately and delete the original. Any unauthorized use of
> this email is prohibited.
> --------------------------------------------------------------------------
-=
> ---------------------
> [mf2]
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=3D4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 09:46:50 -0700
> From: Prasad Godavarti <[log in to unmask]>
> Subject: Re: Antw: [TN] Lead-free Component Finishes
>
> the G-12 committee as well as the NASA whisker site simply suggests the
> following:
>
> a. there is no single event that promotes Sn whiskers
> b. for every theory like this, there is enough contradicting evidence to
> suggest other wise
> c, it is all a matter of "reducing" the risk not eliminating it: in other
> words if you mean" controlling it" as in "minimizing risk" then u are on
> the right track.
>
>
> Prasad Godavarti (Dr. G)
>
>
>
>
>
> Guenter Grossmann
> <Guenter.Grossman
> [log in to unmask]> To
> Sent by: TechNet [log in to unmask]
> <[log in to unmask]> cc
>
> Subject
> 01/26/2004 09:38 Re: [TN] Antw: [TN] Lead-free
> AM Component Finishes
>
>
> Please respond to
> "TechNet E-Mail
> Forum."
> <[log in to unmask]>
> ; Please respond
> to
> Guenter Grossmann
> <Guenter.Grossman
> [log in to unmask]>
>
>
>
>
>
>
> Jim
>
> I was talking last week with a person from Motorola Germany and a
> someone from Collini. In the discussion both told me that by using a Ni-
> underplate and with the appropriate plating chemistry they don't' see
> problems with whiskers anymore. Earlier, in a conference from
> Electrosuisse, I had a discussion with a speaker talking about whisker
> growth as a function of grain size of the Sn plating which can be
> controlled with the appropriate chemistry and process parameters. What I
> learned in these discussion was that whiskers are a problem that can be
> controlled. In the worst case, in my understanding, it's a question of
> money. Annealing the plating can reduce the internal stress in the
> plating and diminish whisker growth.
> Wrong?
>
> Best regards
>
> Guenter
>
>
>
> EMPA
> Swiss Federal Laboratories for Materials Testing and Research
> Centre for Reliability
> Guenter Grossmann, Senior Engineer
>
> 8600 Duebendorf
> Switzerland
>
> Phone: xx41 1 823 4279
> Fax : xx41 1 823 4054
> mail: [log in to unmask]
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 11:12:41 -0700
> From: David Douthit <[log in to unmask]>
> Subject: Re: Lead-free Component Finishes
>
> Lee,
>
> Did any of your tests included lead free BGA/CGA's combined with SnPb
> solder paste?
> If so what were the results.
>
> David A. Douthit
> Manager
> LoCan LLC
>
> Lee Whiteman wrote:
>
> >Jim,
> >
> >1. ACI built hardware with SnPb solders, using components finished with
> >Lead Free finishes (Sn, Pd, NiPd, etc.) for the Lead Free Components
> >Focus Group and our own internal Lead Free Projects, and found no
> >incompatibilities. Of course, the metallurgy of the solder joint was
> >different than what you would expect with SnPb finishes.
> >
> >2. My gut tells me that sooner or later (~ 2006 timeframe), SnPb
> >finishes will no longer be available in the long term. As the conversion
> >from SnPb to Lead Free continues, the availability of components
> >finished with SnPb will decrease. IMHO, the component market requirement
> >for SnPb finished components will not be sufficiently large enough to
> >have component manufacturers support both a SnPb and Lead Free
> >production line for the same electronic package. Of course this also
> >depends on the type of packages (chip components vs. leaded SMT devices
> >vs. etc.).
> >
> >Hope this helps.
> >
> >Good Luck.
> >
> >Lee Whiteman
> >Senior Manufacturing Engineer
> >American Competitiveness Institute
> >E-Mail: [log in to unmask]
> >Ph: (610) 362-1200 x208
> >Fax: (610) 362-1290
> >
> >This message is for informational purposes only and does not supersede,
> >modify, or create any agreements with ACI. Information contained in this
> >message does not bind ACI or its affiliates to any commitment, either
> >express or implied, unless ratified in writing by an authorized
> >representative.
> >
> >-----Original Message-----
> >From: TechNet [mailto:[log in to unmask]] On Behalf Of Marsico, James
> >Sent: Monday, January 26, 2004 9:12 AM
> >To: [log in to unmask]
> >Subject: Re: [TN] Lead-free Component Finishes
> >
> >
> >I wasn't planning to make the change over to lead-free processing. Some
> >concerns with the lead-free initiative are:
> >1) I understand that some component manufacturers have started
> >supplying lead-free finishes without changing the part numbers. If this
> >is true, how will this impact my assembly process if I use PbSn solder?
> >2) If I specify tin-lead finish, some parts may fall under the
> >diminishing manufacturing source (DMS) management requirements. Will
> >tin-lead finished be available down the road?
> >
> >Jim Marsico
> >Senior Engineer
> >Production Engineering
> >EDO Electronics Systems Group
> >[log in to unmask] <mailto:[log in to unmask]> 631-595-5879
> >
> >---------------------------------------------------
> >Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
> >unsubscribe, send a message to [log in to unmask] with following text in
> >the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
> >(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
> >Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
> >posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
> >archives of previous posts at: http://listserv.ipc.org/archives Please
> >visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
> >additional information, or contact Keach Sasamori at [log in to unmask] or
> >847-509-9700 ext.5315
> >-----------------------------------------------------
> >
> >---------------------------------------------------
> >Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> >To unsubscribe, send a message to [log in to unmask] with following text in
> >the BODY (NOT the subject field): SIGNOFF Technet
> >To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> >To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> >Search the archives of previous posts at:
http://listserv.ipc.org/archives
> >Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information,
or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
> >-----------------------------------------------------
> >
> >
> >
> >
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 09:59:41 -0800
> From: John Foster <[log in to unmask]>
> Subject: 0402 SOLDERING
>
> I know that 0402 is a mature technology. I am getting ready to do a board
> which will use all 0402 passives. I have very little experience with 0402.
> From what I have been reading it seems very important that components go
> through the oven broadside so that both sides go liquidous at the same
time.
> I also have read that it is important to keep the copper or thermal
> structures as close as possible on both sides.
>
> What I was hoping to ask is from the experience of people is this really
the
> case anymore. It is very difficult to lay out a board with all of the
> passives facing the same direction. The copper or thermal on both sides is
> very much less difficult.
>
> Any input on this subject would really be appreciated.
>
> Thank You
> John Foster
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 13:04:04 EST
> From: [log in to unmask]
> Subject: Re: 0402 SOLDERING
>
> In a message dated 1/26/2004 1:01:09 PM US Eastern Standard Time,
> [log in to unmask] writes:
> I know that 0402 is a mature technology. I am getting ready to do a board
> which will use all 0402 passives. I have very little experience with 0402.
> From what I have been reading it seems very important that components go
> through the oven broadside so that both sides go liquidous at the same
time.
> There is an alternative. Multicore offers a solder paste that is
> "Anti-tombstoning" and has been written up in a couple of articles for the
magazines.
> The staged reflow of the two alloys in the powder would greatly reduce the
> problems you describe.
>
> Jon Moore
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 13:36:10 -0500
> From: Lee Whiteman <[log in to unmask]>
> Subject: Re: Lead-free Component Finishes
>
> David,
>
> We did not solder any lead free BGA/CGA's combined with SnPb solder
> paste.
>
> However, we did solder BGA's, with SnAgCu balls, with SnPb on a rework
> station. We did get a good solder joint, but we had to operate the
> rework station at a lead free profile to get the balls to reflow.
> Reliability is still a question. As David Suraski, Aim Solders, pointed
> out (and David correct me if I'm wrong), lead contamination in a Lead
> Free solder joint could adversely impact the Lead Free solder joint
> thermal cycle reliability.
>
> We have not seen that lead free contamination phenomena in our tests.
> However, that does not mean it does not exist. I would love to perform a
> series of experiments to see how much lead contamination will cause a
> lead free solder joint to fail thermal cycling (-55C to 125C for 2000
> cycles).
>
> Give me a call off line and let's talk.
>
> Lee Whiteman
> Senior Manufacturing Engineer
> American Competitiveness Institute
> E-Mail: [log in to unmask]
> Ph: (610) 362-1200 x208
> Fax: (610) 362-1290
>
>
> This message is for informational purposes only and does not supersede,
> modify, or create any agreements with ACI. Information contained in this
> message does not bind ACI or its affiliates to any commitment, either
> express or implied, unless ratified in writing by an authorized
> representative.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of David Douthit
> Sent: Monday, January 26, 2004 1:13 PM
> To: [log in to unmask]
> Subject: Re: [TN] Lead-free Component Finishes
>
>
> Lee,
>
> Did any of your tests included lead free BGA/CGA's combined with SnPb
> solder paste? If so what were the results.
>
> David A. Douthit
> Manager
> LoCan LLC
>
> Lee Whiteman wrote:
>
> >Jim,
> >
> >1. ACI built hardware with SnPb solders, using components finished with
>
> >Lead Free finishes (Sn, Pd, NiPd, etc.) for the Lead Free Components
> >Focus Group and our own internal Lead Free Projects, and found no
> >incompatibilities. Of course, the metallurgy of the solder joint was
> >different than what you would expect with SnPb finishes.
> >
> >2. My gut tells me that sooner or later (~ 2006 timeframe), SnPb
> >finishes will no longer be available in the long term. As the
> >conversion from SnPb to Lead Free continues, the availability of
> >components finished with SnPb will decrease. IMHO, the component market
>
> >requirement for SnPb finished components will not be sufficiently large
>
> >enough to have component manufacturers support both a SnPb and Lead
> >Free production line for the same electronic package. Of course this
> >also depends on the type of packages (chip components vs. leaded SMT
> >devices vs. etc.).
> >
> >Hope this helps.
> >
> >Good Luck.
> >
> >Lee Whiteman
> >Senior Manufacturing Engineer
> >American Competitiveness Institute
> >E-Mail: [log in to unmask]
> >Ph: (610) 362-1200 x208
> >Fax: (610) 362-1290
> >
> >This message is for informational purposes only and does not supersede,
>
> >modify, or create any agreements with ACI. Information contained in
> >this message does not bind ACI or its affiliates to any commitment,
> >either express or implied, unless ratified in writing by an authorized
> >representative.
> >
> >-----Original Message-----
> >From: TechNet [mailto:[log in to unmask]] On Behalf Of Marsico, James
> >Sent: Monday, January 26, 2004 9:12 AM
> >To: [log in to unmask]
> >Subject: Re: [TN] Lead-free Component Finishes
> >
> >
> >I wasn't planning to make the change over to lead-free processing.
> >Some concerns with the lead-free initiative are:
> >1) I understand that some component manufacturers have started
> >supplying lead-free finishes without changing the part numbers. If
> >this is true, how will this impact my assembly process if I use PbSn
> solder?
> >2) If I specify tin-lead finish, some parts may fall under the
> >diminishing manufacturing source (DMS) management requirements. Will
> >tin-lead finished be available down the road?
> >
> >Jim Marsico
> >Senior Engineer
> >Production Engineering
> >EDO Electronics Systems Group
> >[log in to unmask] <mailto:[log in to unmask]> 631-595-5879
> >
> >---------------------------------------------------
> >Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
> >unsubscribe, send a message to [log in to unmask] with following text in
> >the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt
> >or
> >(re-start) delivery of Technet send e-mail to [log in to unmask]: SET
> >Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
> >posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
> >archives of previous posts at: http://listserv.ipc.org/archives Please
> >visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
> >additional information, or contact Keach Sasamori at [log in to unmask] or
> >847-509-9700 ext.5315
> >-----------------------------------------------------
> >
> >---------------------------------------------------
> >Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
> >unsubscribe, send a message to [log in to unmask] with following text in
> >the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt
> >or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET
> >Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
> >posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
> >archives of previous posts at: http://listserv.ipc.org/archives Please
> >visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
> additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> >-----------------------------------------------------
> >
> >
> >
> >
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e To
> unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or
> (re-start) delivery of Technet send e-mail to [log in to unmask]: SET
> Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the
> posts: send e-mail to [log in to unmask]: SET Technet Digest Search the
> archives of previous posts at: http://listserv.ipc.org/archives Please
> visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for
> additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 13:46:58 -0600
> From: Luis Gallegos <[log in to unmask]>
> Subject: Re: PBGA Void/pin holes
>
> George
> Is about 8 to 10 microns thick
>
> -----Original Message-----
> From: Wenger, George M. [mailto:[log in to unmask]]
> Sent: Monday, January 26, 2004 10:44 AM
> To: [log in to unmask]
> Subject: Re: [TN] PBGA Void/pin holes
>
>
> Luis,
>
> How thick is your silver plating on your boards?
>
> Regards,
> George
>
> George M. Wenger (908)-546-4531
> Reliability Engineer
> RF Power Amplifier Group
> Andrew Corporation, 40 Technology Drive, Warren, NJ 07059
> [log in to unmask]
>
>
>
> -----Original Message-----
> From: Luis Gallegos [mailto:[log in to unmask]]
> Sent: Monday, January 26, 2004 11:02 AM
> To: [log in to unmask]
> Subject: [TN] PBGA Void/pin holes
>
>
> Good morning Technetters.
> I am having some occasionally voids/pin holes on our PBGA. We are
currently
> using NC293 Sn63/Pb37 Aim solder paste. The board is silver plated.
Printing
> with a 6 mil stencil.
> Is it normal to have occasionally voids?
> We have bake our PBGA's prior to reflow, and also work with the oven
> profile. Any suggestions.
> Thank you
>
> Luis A Gallegos
> Automation Senior Technician
> SANMINA-SCI
> Pleasant Prairie WI
> Phone: 262 947-7700
> [log in to unmask]
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> -----------------------------------------------------
>
> --------------------------------------------------------------------------
--
> --------------------
> This message is for the designated recipient only and may
> contain privileged, proprietary, or otherwise private information.
> If you have received it in error, please notify the sender
> immediately and delete the original. Any unauthorized use of
> this email is prohibited.
> --------------------------------------------------------------------------
--
> --------------------
> [mf2]
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 14:51:38 -0500
> From: "Wenger, George M." <[log in to unmask]>
> Subject: Re: PBGA Void/pin holes
>
> Luis,
>
> Do you mean 8 to 10 microinches? At 40 microinches per micron 8 to 10
micr=
> ons would be 320 to 400 microinches which sound more like electrolytic
plat=
> ing rather than immersion plating.
>
> Regards,
> George
>
> George M. Wenger (908)-546-4531=20
> Reliability Engineer
> RF Power Amplifier Group
> Andrew Corporation, 40 Technology Drive, Warren, NJ 07059
> [log in to unmask]
>
>
>
> -----Original Message-----
> From: Luis Gallegos [mailto:[log in to unmask]]
> Sent: Monday, January 26, 2004 2:47 PM
> To: 'TechNet E-Mail Forum.'; Wenger, George M.
> Subject: RE: [TN] PBGA Void/pin holes
>
>
> George
> Is about 8 to 10 microns thick
>
> -----Original Message-----
> From: Wenger, George M. [mailto:[log in to unmask]]
> Sent: Monday, January 26, 2004 10:44 AM
> To: [log in to unmask]
> Subject: Re: [TN] PBGA Void/pin holes
>
>
> Luis,
>
> How thick is your silver plating on your boards?
>
> Regards,
> George
>
> George M. Wenger (908)-546-4531=20
> Reliability Engineer
> RF Power Amplifier Group
> Andrew Corporation, 40 Technology Drive, Warren, NJ 07059
> [log in to unmask]
>
>
>
> -----Original Message-----
> From: Luis Gallegos [mailto:[log in to unmask]]
> Sent: Monday, January 26, 2004 11:02 AM
> To: [log in to unmask]
> Subject: [TN] PBGA Void/pin holes
>
>
> Good morning Technetters.
> I am having some occasionally voids/pin holes on our PBGA. We are
currently
> using NC293 Sn63/Pb37 Aim solder paste. The board is silver plated.
Printin=
> g
> with a 6 mil stencil.
> Is it normal to have occasionally voids?
> We have bake our PBGA's prior to reflow, and also work with the oven
> profile. Any suggestions.
> Thank you
>
> Luis A Gallegos
> Automation Senior Technician
> SANMINA-SCI
> Pleasant Prairie WI
> Phone: 262 947-7700
> [log in to unmask]
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=3D4.3.1=
> 6
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> -----------------------------------------------------
>
> --------------------------------------------------------------------------
-=
> -
> --------------------
> This message is for the designated recipient only and may
> contain privileged, proprietary, or otherwise private information. =20
> If you have received it in error, please notify the sender
> immediately and delete the original. Any unauthorized use of
> this email is prohibited.
> --------------------------------------------------------------------------
-=
> -
> --------------------
> [mf2]
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=3D4.3.1=
> 6
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> -----------------------------------------------------
>
> --------------------------------------------------------------------------
-=
> ---------------------
> This message is for the designated recipient only and may
> contain privileged, proprietary, or otherwise private information. =20
> If you have received it in error, please notify the sender
> immediately and delete the original. Any unauthorized use of
> this email is prohibited.
> --------------------------------------------------------------------------
-=
> ---------------------
> [mf2]
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=3D4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 16:46:57 -0500
> From: Steve Kelly <[log in to unmask]>
> Subject: Tape and Reel MFG.
>
> Good afternoon,
> We are looking for a source to make us a custom sized tape and reel =
> package for a part which does not fit in any of the standard packages. =
> If required I can be contacted off line. Thanks. Steve Kelly. (416) =
> 750-8433
> --------------------------
> Sent from my BlackBerry Wireless Handheld (www.BlackBerry.net
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=3D4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 16:50:32 -0500
> From: "Morse, Carrie" <[log in to unmask]>
> Subject: Re: Tape and Reel MFG.
>
> In a previous life I had a lot of luck with Advantek.
>
> -Carrie
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Steve Kelly
> Sent: Monday, January 26, 2004 4:47 PM
> To: [log in to unmask]
> Subject: [TN] Tape and Reel MFG.
>
>
> Good afternoon,
> We are looking for a source to make us a custom sized tape and reel =
> package for a part which does not fit in any of the standard packages. =
> If required I can be contacted off line. Thanks. Steve Kelly. (416) =
> 750-8433
> --------------------------
> Sent from my BlackBerry Wireless Handheld (www.BlackBerry.net
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text =
> in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to =
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to =
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: =
> http://listserv.ipc.org/archives
> Please visit IPC web site =
> http://www.ipc.org/contentpage.asp?Pageid=3D4.3.16 for additional =
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 =
> ext.5315
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=3D4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 16:43:19 -0500
> From: "Cagle, James" <[log in to unmask]>
> Subject: Re: Tape and Reel MFG.
>
> Have you tried http://www.argosyinc.com/? They are in Calif.
>
> >
> > James Cagle
> > Tyco Printed Circuit Group-Hayward Division
> > 30000 Eigenbrodt Way
> > Union City, CA 94587
> >
> > Direct: 510 476-5667
> > Fax: 510 476-5601
> > email: [log in to unmask]
> >
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Steve Kelly
> Sent: Monday, January 26, 2004 1:47 PM
> To: [log in to unmask]
> Subject: [TN] Tape and Reel MFG.
>
>
> Good afternoon,
> We are looking for a source to make us a custom sized tape and reel
package
> for a part which does not fit in any of the standard packages. If required
I
> can be contacted off line. Thanks. Steve Kelly. (416) 750-8433
> --------------------------
> Sent from my BlackBerry Wireless Handheld (www.BlackBerry.net
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 17:00:05 -0600
> From: David Tremmel <[log in to unmask]>
> Subject: Board rework
>
> Hello everyone,
>
> There are some populated boards which have an inner trace which needs to
be
> opened.
>
> I need information on either leasing or purchasing the machinery or a
> company (in North America or Mexico) that can drill thru an inner trace
> which needs to be opened, but not entirely through the board.
>
> Each boards needs 2 drillings. I have approx. 15,000 boards.
>
> Thank you in advance for the help.
>
> Thank you,
>
> David Tremmel
> Belmont Trading Company
> 3160 MacArthur Boulevard
> Northbrook, Il 60062
> (847) 412-9690 - Ext. 346
> (847) 858-5540 - Cell
>
> _________________________________________________________________
> Let the new MSN Premium Internet Software make the most of your high-speed
> experience. http://join.msn.com/?pgmarket=en-us&page=byoa/prem&ST=1
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> Date: Mon, 26 Jan 2004 15:32:52 -0800
> From: Ahne Oosterhof <[log in to unmask]>
> Subject: Re: Board rework
>
> LPKF (http://www.lpkfusa.com/RapidPCB/circuitboard.htm) makes a small
> milling machine designed to mill prototype circuit boards, but it can be
> used to solve your problem too. It is computer controlled so you can set
it
> up for the first board, located with alignment pins or such, and then use
> these pins to align all subsequent boards.
>
> Regards,
> Ahne Oosterhof
> 503-641-9428
> [log in to unmask]
>
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of David Tremmel
> Sent: Monday, January 26, 2004 15:00
> To: [log in to unmask]
> Subject: [TN] Board rework
>
>
> Hello everyone,
>
> There are some populated boards which have an inner trace which needs to
be
> opened.
>
> I need information on either leasing or purchasing the machinery or a
> company (in North America or Mexico) that can drill thru an inner trace
> which needs to be opened, but not entirely through the board.
>
> Each boards needs 2 drillings. I have approx. 15,000 boards.
>
> Thank you in advance for the help.
>
> Thank you,
>
> David Tremmel
> Belmont Trading Company
> 3160 MacArthur Boulevard
> Northbrook, Il 60062
> (847) 412-9690 - Ext. 346
> (847) 858-5540 - Cell
>
> _________________________________________________________________
> Let the new MSN Premium Internet Software make the most of your high-speed
> experience. http://join.msn.com/?pgmarket=en-us&page=byoa/prem&ST=1
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
> [log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
> [log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
> for additional information, or contact Keach Sasamori at [log in to unmask] or
> 847-509-9700 ext.5315
> -----------------------------------------------------
>
> ---------------------------------------------------
> Technet Mail List provided as a service by IPC using LISTSERV 1.8e
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
> To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
> Search the archives of previous posts at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
> -----------------------------------------------------
>
> ------------------------------
>
> End of TechNet Digest - 25 Jan 2004 to 26 Jan 2004 (#2004-24)
> *************************************************************
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
