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January 2004

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Subject:
From:
Jack Crawford <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 11 Jan 2004 12:53:30 -0600
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The concept discussed below is already in process by the IPC Solder
Products Value Council. You can download FREE copy of a white paper
about this at http://leadfree.ipc.org/LeadFreeWP006.asp

Jack

Jack Crawford
Director, Certification and Assembly Technology
[log in to unmask]
847-790-5393
fax 847-504-2393
 

-----Original Message-----
From: Tempea, Ioan [mailto:[log in to unmask]] 
Sent: Friday, January 09, 2004 2:45 PM
To: [log in to unmask]
Subject: [TN] Qualification of a lead-free process


Hi Netters and Free folks,

I have a good one about lead-fee. It is common knowledge that lead-free
materials and a process have to be qualified. But what would this mean?

OK, I chose the SMTA Saber board as a test vehicle. I approached a few
paste
suppliers and I will probably use the products of 2 or 3 of them to
stuff a
certain number of boards. I will get support and tweak the reflow and
wave
recipes, let's consider this done. But, what next?

First of all, what quantity of boards would be a good test batch for
each
different paste?

Then, I must confess that I am not a reliability guy, so what tests
should I
perform? Cleanliness (is it really necessary?), pull tests, vibration?
What
accelerated joint reliability tests to do? Simply go through IPC 9701
and
pick something that matches the application?

Any clue would be largely appreciated.

Thanks,
Ioan

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